| Projects | Sample | Mass production |
|---|---|---|
| Layer | 1-40L | 1-32L |
| Thickness | 0.5-17.5mm | 0.5-17.5mm |
| Min Machine Via | 0.1mm | 0.1mm |
| Min Laser Via | 3mil | 3mil |
| HDI Range | 1+n+1、2+n+2、3+n+3 | 1+n+1、2+n+2、3+n+3 |
| Min. Line/Track space | 3/3mil | 3/3mil |
| Impedance control | +/-5% | +/-5% |
| Max Copper Thickness | 12oz | 12oz |
| Max thickness aperture ratio | 0.750694 | 0.750694 |
| Max Size | 650mm X 1130mm | 650mm X 1130mm |
| Material | FR4/Hi-Tg/Rogers/Halogen Free/RCC/PTFE/Nelco/Mixed Stack-Up Material | |
| Surface Finishing | HASL, HASL PB FREE, Immersion Gold/Tin/Silver, Gold Finger Plating, OSP, Immersion Gold+OSP | |
| Special Process | Buried blind vias, stepped grooves, metal substrates, embedded resistors, embedded capacitors, mixed stack, flex-rigid board, back drilling, stepped gold fingers, etc. | |
| Layer | Mass production | Sample | Expedited |
|---|---|---|---|
| 2L | 7 days | 3 days | 24h |
| 4L | 10 days | 4 days | 2 days |
| 6L | 12 days | 6 days | 3 days |
| 8L | 12 days | 7 days | 4 days |
| 10L | 14 days | 10 days | 4 days |
| 12L | 14 days | 10 days | 5 days |
| 14L | 16 days | 12 days | 6 days |
| 16L | 16 days | 12 days | 6 days |
| 18L | 18 days | 14 days | 6 days |
| 20L | 18 days | 14 days | 10 days |
| 22L | 20 days | 14 days | 10 days |
| 24L | 20 days | 14 days | 10 days |
| 26L | 20 days | 14 days | 10 days |
| 28L | 20 days | 14 days | 10 days |
| 30L | 20 days | 14 days | 10 days |
| 32L | 20 days | 14 days | 10 days |
Adhere to source the original materials, ensure product quality from the source, and restrictly follow IPQC standards and partners requirements.
IPC standard control to ensure reliable production and guarantee high qualified rate of product shipment.
Equipped with advanced inspection equipment, including but not limited to Online AOI and Skyray Instrument ROHS.
100% shipment inspection, and strictly follow various requirement such as anti-static, waterproof and moisture-proof, anti-extrusion, anti-fall and anti-collision.
