SMT-PCB Assembly Manufacturer_PCB Prototype

Production Process

Process Capability

There are currently 6 SMT lines, equipped with new imported Yamaha machine, automatic solder paste printer, SPI solder paste detector, ten temperature zone reflow furnace, Online AOI, X-ray lines and other high-end equipment, with a mounting capacity of 8 million solder joints/day, especially good at high precision, high complexity of the single board, with the production of 40000 + solder joints of ultra-complex single board actual performance.

SMT Capacity	8 million solder joints/day
SMT Lines	6 high-speed patch lines, 1 patch proofing line
Throwing Rate	Resistance capacitance ratio 0.3%
Throwing Rate	IC type non throwing material
Board Type	POP/Common Board/FPC/Rigid-Flex Board/Metal Base Board

Specifications of Mounting Components	Stickable Minimum Package	03015 Chip/0.35 Pitch BGA
	Minimum Device Accuracy	±0.04mm
	IC Chip Precision	±0.03mm
Specifications of Mounting PCB	PCB Size	5050mm - 774710mm
Specifications of Mounting PCB	PCB Thickness	0.3-6.5mm

Equipment Pictures

Quality Control

3D SPI

The new SPI can accurately detect the solder paste printing defects such as excessive/insufficient tin, missing printing offset, etc., to ensure the quality.

Online AOI

Newly updated AOI can accurately detect the mounting problems of components such as wrong parts, missing parts and reverse direction, and the welding quality.

3D X-ray

Inspect the solder situation of components, from three-dimensional, like BGA, and reproduce the internal structure in all directions without blind spots.

Smart First-Piece Tester

Test the first sample according to the production data to ensure that the sample quality and function are consistent, and ensure the project promoting smoothly.

Production Advantage

One-Stop Service

High-speed and high-precision reliability equipment, supporting testing and assembly production lines, providing one-stop PCBA OEM services for PCB manufacturing, SMT processing, stencil, components sourcing, DIP plug-in post welding,function test and final assembly.
Raw Material Guarantee

Adhere to guarantee the quality from the source, use the solder paste of Senju brand imported from Japan, purchase all electronic components from the original factory or the first level agent, and trace each material to the original factory to ensure the authenticity.
Quality Assurance

The production line is equipped with new SPI, AOI, 3D X-ray and First-Piece tester inspection equipment. During the production process, it will also undergo strict IPQC production inspection, QC manual inspection and QA delivery inspection to ensure that the delivered products are free of any quality problems.
Whole Process Follow-Up

Senior engineers and technical teams follow up the whole process of the project to solve various EQs in the production process of the project and ensure the best lead time.
Highly Cost-Effective

From one piece to mass production, we can paste bulk materials, and the cost of each placement is as low as 0.0012 USD/point.
System Certification

Our factory has passed ISO9001, ISO14001, ISO13485, UL and other international quality management system certification, and the products meet RoHs environmental requirements.

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