How does the PCB surface treatment process affect SMT soldering quality?

In PCB assembly production, there are many factors that can affect SMT soldering quality. Issues with PCBs, electronic components, solder paste, equipment, or any other aspect can impact SMT soldering quality. So, what kind of influence does the PCB surface treatment process have on SMT soldering quality?

PCB surface treatment processes mainly include OSP, electroplated gold, tin spraying/dipping, and gold/silver immersion. The specific choice of which process to use depends on the actual product requirements. PCB surface treatment is a crucial step in the PCB manufacturing process, primarily serving to enhance soldering reliability and prevent corrosion and oxidation. Therefore, the PCB surface treatment process is a significant factor influencing soldering quality.

If there are issues with the PCB surface treatment process, it can first lead to oxidation or contamination of solder joints, directly affecting soldering reliability and causing soldering defects. Additionally, the PCB surface treatment process can impact the mechanical performance of solder joints. For example, excessive surface hardness can easily lead to solder joint detachment or cracking.