The immersion gold process is a surface treatment method for PCB assembly, also known as chemical nickel-gold, electroless nickel-gold, or immersion nickel-gold. The immersion gold process deposits a ...
During PCB assembly, surface treatment is a crucial step. Organic Solderability Preservatives (OSP) is a commonly used surface treatment that can improve the reliability and quality of soldering.OSP s...
PCB assembly is a crucial part of the electronics manufacturing process, which involves assembling various components onto a printed circuit board. In PCB assembly, the type of printed circuit board i...
Wetting failure is a common defect in the PCB assembly process. The main manifestation of wetting failure is that the PCB pads and solder cannot be fully fused during the SMT soldering process. Theref...
Component offset is a common problem during PCB assembly process, which may lead to poor soldering, decreased electrical performance, and even affect the overall product quality. This article will exp...