What causes PCB delamination?
"PCB delamination" typically refers to the phenomenon of layer separation or detachment occurring during the PCB manufacturing process. This may be due to poor manufacturing processes or other factors. Here are some common reasons that lead to PCB delamination:
1. Mismatched Materials: PCBs are often composed of multiple layers stacked together, including substrates, copper foils, and possibly other layers. If the materials between these layers are chosen improperly or if factors like pressure and temperature are inappropriate, it may lead to the separation of materials between layers, resulting in delamination issues.
2.Thermal Stress: During the manufacturing process, particularly in high-temperature or heat treatment processes, inappropriate temperature changes can cause expansion and contraction of materials within the PCB, leading to delamination.
3. Chemical Reactions: The chemicals used in PCB manufacturing might trigger adverse chemical reactions between materials, leading to separation.
4. Improper Lamination Process: The lamination process in PCB manufacturing is critical. If the lamination process is incorrect or if the pressure and temperature used are unsuitable, it could lead to separation between layers.
5. Material Defects: If defects such as bubbles or cracks exist in the materials used, such as substrates or other layers, it can lead to separation between layers in the PCB.
6. Improper Manufacturing Processes: Each step in PCB manufacturing requires precise control. If parameters for a particular step are incorrect, such as temperature, pressure, or time, it could result in delamination issues.
7. Environmental Factors: Environmental factors like humidity, temperature, and other conditions in the PCB manufacturing environment might affect the adhesive properties of materials, leading to separation between layers.
To prevent PCB delamination issues, the following measures should be taken:
Material Selection: Ensure that the materials used, including substrates, copper foils, and other components, are compatible and possess adequate adhesive strength.
Lamination Process: Ensure the appropriate lamination process, including the correct temperature, pressure, and time settings.
Manufacturing Control: Throughout the manufacturing process, ensure accurate control and monitoring of parameters for each step.
Environmental Control: Maintain control over humidity, temperature, and other environmental factors in the manufacturing environment to ensure material adhesion properties.
By adhering to correct manufacturing processes, material selection, and environmental control, the risk of PCB delamination issues can be minimized, thereby ensuring the production of high-quality and stable printed circuit boards.