What are the differences between PCB through-holes, buried vias, and blind vias？

PCB drilling is a crucial step in the PCB manufacturing process, with different types such as through-holes, blind vias, and buried vias. They serve different purposes and have distinct structures. Let's delve into their differences in detail!

Through-holes, as the name suggests, penetrate the board from one side to another, typically used to connect circuits across different layers and provide mechanical support for components like DIP packages during soldering.

Blind vias are drilled only partially, connecting circuits between the surface and inner layers of the PCB. This feature helps save space and increase wiring density in PCB design.

Buried vias are entirely within the PCB, invisible from the surface. They are primarily utilized for internal circuit connections, often in high-layer PCBs, enhancing structural strength and reliability.

These are the primary distinctions among PCB through-holes, buried vias, and blind vias. Proper selection and usage of different drilling types are crucial for positively impacting the performance and reliability of PCBs!