Wetting failure is a common defect in the PCB assembly process. The main manifestation of wetting failure is that the PCB pads and solder cannot be fully fused during the SMT soldering process. Theref...
Component offset is a common problem during PCB assembly process, which may lead to poor soldering, decreased electrical performance, and even affect the overall product quality. This article will exp...
During the PCB Assembly process, some defects are inevitably encountered, especially during the soldering process. Tombstone effect is one of the common soldering defects in PCBA assembly, which mainl...
Welding process is an important process in PCB assembly process, which mainly includes three welding processes: reflow soldering, wave soldering, and hand soldering. Due to the complexity of the proce...
In the PCB assembly process, poor soldering is a common problem, and one of the most common issues is SMT cold soldering. SMT cold soldering refers to the situation where the solder cannot fully wet t...