Technical Specifications · Engineering Reference

PCB Fabrication
Capabilities

Check our PCB fabrication limits for layers, materials, board thickness, trace and spacing, drilling, vias, copper weight, impedance control and surface finishes before releasing your design for production.

Up to 40 Layers

3mil / 3mil Trace

8 PCB Types

Impedance ±5%

LZJPCB PCB fabrication facility showing multilayer PCB manufacturing process

50,000 sqm / mo

Production Capacity

Specifications

Select Your PCB Type

Select a PCB type below to view detailed fabrication capabilities, material options and engineering specifications.

Rigid PCB Fabrication Capabilities

Fabrication Item	LZJPCB Capabilities	Engineering Notes
PCB Layers	Prototype: 1-40 Layers / Production: 1-32 Layers	Supports double-sided, multilayer and complex high-layer-count PCBs
PCB Materials	FR4, High Tg FR4, Rogers, PTFE, Nelco, Halogen-Free, RCC, Mixed Materials, etc.	Material is selected according to electrical, thermal and reliability requirements
Board Thickness	0.2-17.5 mm	Supports ultra-thin, standard and thick-board structures
Maximum Board Size	650 × 2000 mm	Suitable for standard and large-format PCB requirements
Min Trace Width / Spacing	Down to 3 / 3 mil	Supports high-density routing and fine-pitch component fan-out
Min Mechanical Drill	Down to 0.10 mm	Actual limit depends on board thickness, copper thickness and aspect ratio
Laser Microvia	Supported	Microvia dimensions are reviewed according to HDI stack-up and materials
HDI Structures	1+N+1, 2+N+2, 3+N+3	Supports blind vias, buried vias, laser microvias and sequential lamination
Maximum Aspect Ratio	Up to 16:1	Suitable for high-layer-count and thick-board PCBs
Maximum Copper Thickness	Up to 12 oz	Supports heavy copper, high-current and power electronics designs
Impedance Control	Controllable to ±5%	Supports single-ended and differential impedance requirements
Surface Finishes	HASL, Lead-Free HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Plating Gold, Plating Tin, ENEPIG	Finish is selected according to solderability, bonding and reliability requirements
Via & Interconnect	Blind Via, Buried Via, Laser Microvia, Via-in-Pad, Filled Via	Suitable for HDI, BGA and high-density interconnect designs
Advanced Processes	Back Drilling, Stepped Grooves, Edge Plating, Gold Fingers, Mixed Stack-Up, Embedded R/C	Supports high-speed, high-reliability and special-structure PCB designs
Special Materials	Aluminum, Copper Core, Rogers / RF, Hybrid Material PCB	Supports thermal, RF and mixed-material applications
Production Stages	Prototype, NPI, Low Volume, Mass Production	Supports projects from engineering validation through repeat production

Flex PCB Fabrication Capabilities

Fabrication Item	LZJPCB Capabilities	Engineering Notes
Flex PCB Layers	1-8 Layers	Supports single-sided, double-sided and multilayer flexible circuits
Base Material	Polyimide-Based Flex Materials	Material selection depends on flex structure, thermal requirements and bend life
Flex Construction	Single-Sided, Double-Sided, Multilayer Flex	Structure is selected according to routing density and mechanical requirements
Finished Thickness	Engineering Confirmation Required	Final thickness depends on copper, polyimide, adhesive and coverlay construction
Min Trace Width / Spacing	Engineering Confirmation Required	Fine-line capability depends on copper thickness and flex material construction
Mechanical Drill	Supported	Hole capability depends on total flex thickness and copper construction
Laser Microvia	Supported Where Applicable	Suitable for high-density flex designs
Coverlay	Supported	Coverlay openings are controlled around pads, fingers and component areas
Stiffeners	Supported	PI, FR4 or project-specific stiffeners can be reviewed according to assembly requirements
Controlled Impedance	Supported	Stack-up and impedance requirements should be defined before fabrication
Gold Fingers	Supported	Suitable for applicable flex connector interfaces
Surface Finishes	ENIG, Immersion Tin, OSP and Project-Specific Finishes	Finish selection depends on soldering, connector and reliability requirements
Dynamic Flex Designs	Engineering Review Required	Bend radius, copper direction and repeated-flex requirements should be reviewed before production
Special Shapes	Supported	Flex outlines, cut-outs and irregular structures can be produced according to fabrication data
Production Stages	Prototype, Low Volume, Volume Production	Supports flex PCB development through repeat manufacturing

Rigid-Flex PCB Fabrication Capabilities

Fabrication Item	LZJPCB Capabilities	Engineering Notes
PCB Structure	Rigid-Flex PCB	Combines rigid component areas with integrated flexible interconnections
Layer Count	Engineering Confirmation Required	Available structure depends on rigid and flex layer configuration
Rigid Materials	FR4, High Tg FR4 and Applicable Special Materials	Rigid material can be selected according to electrical and thermal requirements
Flex Materials	Polyimide-Based Flex Materials	Flex construction is selected according to bend and reliability requirements
Rigid-Flex Transition	Supported	Transition areas are controlled to reduce mechanical stress and fabrication risk
Min Trace Width / Spacing	Engineering Confirmation Required	Capability depends on copper weight, layer construction and material combination
Mechanical Drill	Supported	Final drill capability depends on stack-up and total thickness
Laser Microvia	Supported Where Applicable	Suitable for high-density rigid-flex interconnections
Blind & Buried Vias	Supported	Available for applicable multilayer rigid-flex structures
Via-in-Pad / Filled Via	Supported Where Required	Suitable for dense BGA and high-density designs
Coverlay	Supported	Used on flexible circuit areas according to design requirements
Stiffeners	Supported	Available where connector, component or mechanical reinforcement is required
Controlled Impedance	Supported	Requires controlled stack-up and material parameters
Surface Finishes	ENIG, Immersion Silver, Immersion Tin and Applicable Finishes	Finish is selected according to assembly and connector requirements
Production Stages	Prototype, Low Volume, Volume Production	Supports rigid-flex development and repeat production

HDI PCB Fabrication Capabilities

Fabrication Item	LZJPCB Capabilities	Engineering Notes
HDI Layer Count	4-20 Layers	Supports compact multilayer and high-density PCB structures
HDI Structures	1+N+1, 2+N+2, 3+N+3	Supports multiple sequential lamination structures
Any-Layer HDI	Engineering Review	Feasibility depends on stack-up, materials and microvia structure
Laser Microvia	Supported	Used for fine-pitch BGA breakout and high-density interconnect
Blind Vias	Supported	Connects outer layers to selected internal layers
Buried Vias	Supported	Supports internal-layer interconnection without occupying external routing space
Via-in-Pad	Supported	Suitable for BGA, QFN and high-density component layouts
Filled Via	Supported	Available for applicable via-in-pad and stacked microvia structures
Min Trace Width / Spacing	Down to 3 / 3 mil	Supports dense routing and fine-pitch fan-out
Min Mechanical Drill	Down to 0.10 mm	Final limit depends on PCB thickness and aspect ratio
Sequential Lamination	Supported	Used for multi-step HDI build-up structures
Controlled Impedance	Controllable to ±5%	Supports high-speed differential and single-ended signals
Mixed Stack-Up	Supported	Applicable special materials can be combined after engineering review
Surface Finishes	ENIG, ENEPIG, OSP and Other Applicable Finishes	Finish should be selected according to package and assembly requirements
Production Stages	Prototype, NPI, Low Volume, Volume Production	Supports HDI projects from validation to repeat production

Metal Core PCB Fabrication Capabilities

Fabrication Item	LZJPCB Capabilities	Engineering Notes
PCB Types	Aluminum PCB, Copper Core PCB	Designed for applications requiring improved thermal transfer
Layer Structure	Single-Sided and Applicable Multilayer Structures	Structure depends on thermal and electrical isolation requirements
Metal Base	Aluminum / Copper	Base metal is selected according to thermal performance and project requirements
Board Thickness	Engineering Confirmation Required	Total thickness includes copper, dielectric and metal base
Copper Thickness	Engineering Confirmation Required	Higher copper weights require wider fabrication tolerances
Thermal Dielectric	Available in Multiple Thermal Grades	Dielectric is selected according to thermal conductivity and insulation requirements
Min Trace Width / Spacing	Down to 3 / 3 mil Where Applicable	Final capability depends on copper thickness and circuit structure
Mechanical Drilling	Supported	Hole design depends on metal-base structure and electrical isolation requirements
Thermal Via Design	Supported Where Applicable	Used to improve heat transfer in applicable PCB structures
Controlled Impedance	Engineering Review	Feasibility depends on dielectric structure and stack-up
Surface Finishes	HASL, Lead-Free HASL, ENIG, OSP and Applicable Finishes	Selected according to assembly and reliability requirements
Routing / V-Cut	Supported	Board separation method is selected according to PCB construction
Special Shapes	Supported	Suitable for LED, power electronics and mechanically customized designs
Production Stages	Prototype, Low Volume, Mass Production	Supports thermal PCB projects from development through volume production

Ceramic PCB Fabrication Capabilities

Fabrication Item	LZJPCB Capabilities	Engineering Notes
Ceramic Materials	Alumina (Al₂O₃), Aluminum Nitride (AlN), Si₃N₄, LTCC	Material is selected according to thermal, electrical and mechanical requirements
Ceramic Processes	DBC, AMB, Thick Film, Thin Film	Fabrication process depends on substrate material and circuit requirements
Layer Structure	Single-Layer and Applicable Multilayer Structures	Final construction depends on selected ceramic technology
Substrate Thickness	Engineering Confirmation Required	Thickness should be selected according to mechanical and thermal requirements
Copper / Metallization Thickness	Engineering Confirmation Required	Depends on DBC, AMB or metallization process
Min Trace Width / Spacing	Engineering Confirmation Required	Fine-line capability depends on the selected ceramic fabrication process
Laser Drilling	Supported Where Applicable	Used for applicable holes, features and ceramic processing requirements
Thermal Performance	Material-Dependent	AlN and other ceramic materials can be selected for higher thermal requirements
Electrical Insulation	High-Insulation Ceramic Substrates Available	Suitable for power electronics and high-voltage applications
Surface Finishes	Project-Specific Finishes Available	Finish selection depends on soldering, bonding and package requirements
Special Shapes	Supported	Ceramic geometry is reviewed according to machining and mechanical constraints
DBC / AMB Structures	Supported	Suitable for high-power modules and thermal-management applications
Production Stages	Prototype, Low Volume, Volume Production	Supports ceramic PCB development and production requirements

RF & High-Frequency PCB Fabrication Capabilities

Fabrication Item	LZJPCB Capabilities	Engineering Notes
RF Materials	Rogers RO4003C, RO4350B, RT/duroid 5880, RO3000 Series, PTFE, Nelco	Material selection depends on frequency, dielectric constant and loss requirements
Hybrid Stack-Up	Supported	RF materials can be combined with FR4 or other applicable materials after engineering review
Layer Count	Engineering Confirmation Required	Supports applicable single-layer and multilayer RF PCB structures
Board Thickness	Engineering Confirmation Required	Thickness tolerance depends on laminate and stack-up
Dielectric Control	Supported	Controlled dielectric thickness is important for RF impedance performance
Min Trace Width / Spacing	Down to 3 / 3 mil Where Applicable	Final capability depends on copper thickness and RF material
Controlled Impedance	Controllable to ±5%	Supports RF transmission lines and high-speed differential signals
Copper Options	Standard and Applicable Low-Profile Copper	Copper roughness can affect high-frequency insertion loss
Back Drilling	Supported	Reduces via stub effects in high-speed and high-frequency designs
Blind / Buried Vias	Supported Where Applicable	Suitable for dense multilayer RF PCB layouts
Via-in-Pad	Supported Where Required	Used for dense RF components and BGA packages
Edge Plating	Supported	Available for applicable shielding and grounding structures
Surface Finishes	ENIG, ENEPIG, Immersion Silver and Applicable Finishes	Finish selection depends on RF, soldering and bonding requirements
Mixed Materials	Supported	Stack-up requires engineering review for CTE and lamination compatibility
Production Stages	Prototype, Low Volume, Volume Production	Supports RF PCB validation through repeat manufacturing

Heavy Copper PCB Fabrication Capabilities

Fabrication Item	LZJPCB Capabilities	Engineering Notes
Maximum Copper Thickness	Up to 12 oz	Suitable for high-current, power conversion and thermal applications
PCB Layers	Single-Sided, Double-Sided and Multilayer	Available construction depends on copper weight and total PCB thickness
Board Thickness	Up to Applicable Rigid PCB Limits	Thick copper and high layer counts increase total board thickness
Min Trace Width / Spacing	Engineering Review Required	Required spacing increases as copper thickness increases
Mechanical Drill	Supported	Hole size and drill capability depend on board thickness and copper weight
Plated Through Holes	Supported	Hole-wall copper requirements should be defined for high-current designs
Aspect Ratio	Up to Applicable Rigid PCB Capability	Final capability depends on board thickness and hole diameter
Copper Distribution	Engineering Controlled	Copper balance helps reduce warpage and uneven etching
Etching Compensation	Supported	Trace geometry is adjusted according to copper thickness
Thermal Management	Supported	Heavy copper improves current capacity and heat spreading
Edge Plating	Supported Where Required	Available for applicable electrical and mechanical requirements
Surface Finishes	HASL, Lead-Free HASL, ENIG and Applicable Finishes	Surface finish depends on assembly and application requirements
Special Structures	Heavy Copper / Mixed Copper Weight Structures	Different copper weights can be reviewed according to stack-up requirements
Controlled Impedance	Engineering Review Required	Thick copper geometry significantly affects impedance design
Production Stages	Prototype, Low Volume, Mass Production	Supports heavy copper projects from engineering validation through production

1 mil = 0.0254 mm · 1 oz copper ≈ 35 μm · Advanced and non-standard specifications are subject to engineering confirmation based on PCB materials, stack-up, copper thickness and design files.

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