FR4 PCB
Manufacturer
Get custom FR4 PCBs manufactured from 1 to 32 layers with precise routing, flexible thickness options, and FR4 material grades matched to your electrical and thermal requirements. LZJPCB supports DFM engineering, 100% electrical testing, and PCB assembly from rapid prototypes to mass production.
- 1–32 Layer FR4 PCBs
- 0.4–4.0 mm Board Thickness
- 3/3 mil Trace & Space
- 100% Electrical Testing
Custom FR4 PCB Manufacturing Capabilities
Get custom FR4 PCBs manufactured with material grades, layer counts, copper thicknesses, and precision fabrication matched to your electrical, mechanical, and assembly requirements.
FR4 Materials & Tg Options
Choose FR4 materials matched to your soldering temperatures, operating environment, and electrical requirements.
- Standard FR4: Tg135
- Mid-Tg FR4: Tg150–155
- High-Tg FR4: Tg170–180
- Halogen-Free FR4, RCC & Mixed-Material Stackups
FR4 PCB Layers & Thickness
Manufacture rigid FR4 PCBs with custom layer counts and finished thicknesses to meet your enclosure and stackup requirements.
- 1–40 Layers for Prototype & Special Builds
- 1–32 Layers for Volume Production
- 0.20–17.50 mm Finished Board Thickness
- Custom Core, Prepreg & Stackup Construction
FR4 PCB Size & Precision Capabilities
Support large-format boards and fine-pitch circuits with precision imaging, drilling, and dimensional control.
- Maximum Board Size: 650 × 2000 mm
- Minimum Trace / Spacing: 3/3 mil
- Minimum Mechanical Drill: 0.10 mm
- Precision Routing & Dimensional Control
FR4 PCB Copper Weight & Current Capacity
Support power electronics and high-current applications with custom copper thicknesses and controlled conductor geometry.
- Copper Thickness: Up to 12 oz
- Base & Finished Copper Specifications
- Heavy Copper Circuit Fabrication
- Copper Distribution & Thermal Management
FR4 PCB Vias & Advanced Processes
Manufacture complex FR4 circuits with multilayer interconnections, precision drilling, and specialized fabrication processes.
- Plated Through-Holes, Blind & Buried Vias
- Back Drilling for High-Speed Signals
- Embedded Resistor & Capacitor Options
- Controlled Impedance Manufacturing
FR4 PCB Surface Finishes & Gold Fingers
Select surface finishes for your soldering, connector durability, and assembly requirements.
- HASL & Lead-Free HASL
- ENIG, OSP, Immersion Silver & Tin
- Hard Gold & Gold Fingers
- Stepped Gold Fingers
Custom FR4 PCB Manufacturing Without Guesswork
FR4 is not one universal laminate. We convert electrical, thermal and mechanical requirements into a controlled material, stack-up, copper build and finished-board specification.
FR4 Material, Laminate, Substrate and Core Options
A rigid FR4 PCB combines copper foil, cured glass-epoxy core and prepreg. LZJPCB records the selected material grade and construction in the approved stack-up so purchasing, engineering and production use one definition.
Standard FR4
General industrial, control, consumer and instrumentation boards.
High-Tg FR4
Higher thermal margin for demanding assembly and operating conditions.
Halogen-Free FR4
Selected when the product specification requires halogen-free material.
RCC / Mixed Stack-Up
Used where HDI or combined electrical performance needs another dielectric.
Choose FR4 PCB Thickness and Lock the Tolerance Before Production
Finished board thickness affects connector fit, rigidity, impedance and stack-up. LZJPCB supports FR4 PCB thickness from 0.20 mm to 17.50 mm. Nominal thickness and tolerance are controlled on the approved fabrication drawing.
- Thickness is measured during final inspection.
- Connector interfaces and card guides drive finished thickness.
- High-copper builds require stack-up balance review.
- Tight tolerance is confirmed before production release.
Select the Right FR4 Tg Class
Tg is the glass-transition temperature of the laminate system. It is not the PCB's continuous operating-temperature rating.
Standard class
Mid-Tg class
High-Tg class
- Match Tg to your soldering profile and product environment.
- High-layer-count boards often need mid-Tg or high-Tg materials.
- Material claims trace to the laminate supplier datasheet.
Specify FR4 PCB Copper Thickness Correctly
Specify the finished requirement and any local heavy-copper area to prevent quotation and impedance errors. LZJPCB supports copper thickness up to 12 oz.
Base copper
Copper foil supplied with the laminate.
Finished copper
Final copper after plating and processing.
Internal copper
Defined per inner layer in the stack-up.
LZJPCB range
Copper thickness up to 12 oz.
FR4 PCB Prototype & Volume Production
From quick-turn prototypes to mass production, get your FR4 PCBs manufactured with custom stackups, precision fabrication, and consistent quality control.
Engineering prototype
Design validation, fit checks and first-article testing before volume commitment.
Rush references
2L: 12 hours · 4L: 24 hours · 6L: 48 hours for qualifying standard builds.
Pilot / small batch
Process confirmation, assembly trial and first production qualification run.
Controlled inputs
Approved Gerber, drawing, stack-up, material and EQ responses.
Volume production
Stable repeat delivery against the frozen specification and process records.
Release control
Engineering changes are reviewed before they enter production.
FR4 PCB Material Properties
Choose FR4 materials based on dielectric performance, thermal resistance, and dimensional stability to meet your PCB's electrical, mechanical, and assembly requirements.
FR4 Material Construction & Grades
Get FR4 PCBs manufactured with glass-epoxy laminates, cores, and prepregs matched to your stackup and performance requirements. Material grades and construction details are documented for consistent production.
FR4 laminate combines woven glass reinforcement with a flame-retardant epoxy resin system, providing rigidity, electrical insulation, and dimensional stability.
- Glass-Epoxy Laminate & Copper-Clad Core
- Core, Prepreg & Glass Fabric Construction
- Material Grades & Technical Datasheets
- Material Traceability & Compliance Documentation
FR4 Electrical & Dielectric Properties
Maintain signal integrity and controlled impedance with FR4 dielectric properties matched to your circuit requirements. Laminate Dk, Df, dielectric thickness, and copper geometry are considered together.
LZJPCB controls finished impedance to ±5% when the approved stack-up and coupon plan specify it.
- Dielectric Constant (Dk) & Dissipation Factor (Df)
- Dielectric Thickness & Stackup Configuration
- Controlled Impedance & Signal Loss
FR4 Thermal Properties
Select FR4 materials suited to your soldering process, thermal exposure, and product environment. Compare Tg, decomposition temperature, and thermal expansion instead of relying on Tg alone.
Thermal claims trace to the exact laminate supplier datasheet, not generic FR4 category assumptions.
- Glass Transition Temperature (Tg)
- Decomposition Temperature (Td)
- Coefficient of Thermal Expansion (CTE)
- Thermal Conductivity & Heat Transfer
FR4 Mechanical & Dimensional Properties
Maintain PCB dimensions, component alignment, and assembly fit with suitable laminate construction and controlled manufacturing processes.
Balanced stackups and copper distribution help reduce warpage and registration issues across all FR4 builds.
- Board Rigidity & Mechanical Strength
- Dimensional Stability & Layer Registration
- Bow, Twist & Finished Thickness Control
FR4 PCB Applications
Get custom FR4 PCBs for industrial, automotive, medical, communication, and consumer electronics, with materials, copper thicknesses, and layer structures matched to your product requirements.
Telecommunications
Support networking equipment, communication controllers, and interface modules with multilayer FR4 PCBs. Controlled impedance, precision drilling, and dense routing help meet your signal and interconnection requirements.
Explore Communication PCB →Medical Electronics
Manufacture FR4 PCBs for diagnostic equipment, monitoring systems, and medical control modules. Material selection, precision fabrication, and documented inspection support your product's quality requirements.
Explore Medical PCB →Automotive Electronics
Support automotive controllers, sensor modules, and vehicle electronic systems with FR4 PCBs matched to thermal and electrical demands. High-Tg materials, controlled copper thickness, and quality testing support consistent manufacturing.
Explore Automotive PCB →Industrial Control
Build FR4 PCBs for PLCs, motor controllers, and industrial automation equipment. Multilayer routing, heavy copper options, and precision fabrication support your power distribution and control circuits.
Explore Industrial PCB →Instrumentation
Manufacture FR4 PCBs for measurement equipment, laboratory instruments, and electronic testing systems. Fine-line routing, controlled impedance, and consistent layer structures support your precision circuit requirements.
Explore Instrumentation PCB →Smart & Wearable Electronics
Fit compact control circuits, sensors, and wireless modules into space-constrained devices with thin FR4 PCBs. Fine-pitch routing and custom board outlines help meet your component placement and enclosure requirements.
Explore Consumer Electronics PCB →FR4 PCB Standards & Flame-Retardant Ratings
Get FR4 PCBs manufactured with specified laminate grades, applicable IPC standards, verified flame-retardant ratings, and quality documentation matched to your project requirements.
IPC-4101 Material Specifications
Select FR4 laminates that meet your electrical, thermal, and mechanical requirements. Material grades and applicable IPC-4101 specifications help define consistent PCB construction.
UL 94 Flame-Retardant Ratings
Verify the UL 94 V-0 classification for your selected FR4 laminate and applicable material thickness. Flame-retardant performance is supported by the material supplier's test or certification records.
PCB Quality Standards & Certifications
Support your PCB quality requirements with ISO 9001 quality management and applicable IPC manufacturing standards. Request relevant factory certifications and inspection documentation for your project.
RoHS & REACH Compliance
Meet your environmental compliance requirements with suitable FR4 materials and documented manufacturing specifications. Request applicable RoHS and REACH declarations and supporting material records.
Why Choose LZJPCB as Your FR4 PCB Manufacturer
With PCB manufacturing experience since 2006, 50+ engineers, and four production bases, LZJPCB supports your custom FR4 PCB projects from rapid prototyping to mass production.
FR4 PCB Manufacturing Built Around Your Project Requirements
Get the right FR4 materials, engineering support, and manufacturing capacity for your PCB specifications, budget, and delivery schedule.
- FR4 Material & Cost Optimization — Choose standard, high-Tg, or halogen-free FR4 materials matched to your electrical, thermal, and cost requirements.
- Engineering Support & Integrated PCB Assembly — Get DFM engineering, FR4 PCB fabrication, component sourcing, SMT/THT assembly, and testing through one supplier.
- Fast Prototyping & Scalable Production — Move from quick-turn FR4 prototypes to repeat production with controlled specifications, four production bases, and consistent quality inspection.
FR4 PCB Manufacturing Case Studies
Explore how FR4 PCB manufacturing addresses stackup, material selection, production consistency, and quality requirements across different projects.
Multilayer FR4 PCB Prototype
For an 8-layer industrial sensor prototype, DFM engineering and stackup optimization confirmed 1oz copper and 0.2mm drilling, passing electrical tests on 50 units.
View Case StudyFR4 PCB Volume Production
For repeat production of a consumer power module, controlled laminate sourcing and 100% electrical testing held dimensional accuracy across 20,000 boards.
View Case StudyFR4 PCB vs Other PCB Materials
Compare FR4 with alternative PCB substrates to choose the right balance of electrical performance, thermal resistance, mechanical strength, and manufacturing cost.
FR1 vs FR4 vs FR5
Compare paper-based and glass-epoxy laminates to select the appropriate material for your PCB's complexity, thermal requirements, and budget.
Cost-Effective for Simple Circuits
Suitable for basic, typically single-sided circuits with limited thermal and mechanical requirements.
- Paper-Based Phenolic Laminate
- Simple, Low-Density PCB Designs
- Cost-Sensitive Electronics
Versatile Rigid PCB Manufacturing
Choose FR4 for reliable electrical insulation, multilayer construction, and a broad range of industrial and commercial electronics.
- Glass-Epoxy Laminate
- Single to Multilayer Construction
- Standard & High-Tg Options
Higher Thermal-Performance Requirements
Consider FR5 when your project specifies a higher-temperature glass-epoxy laminate and its verified material properties meet your requirements.
- Higher-Tg Material Class
- Thermal-Resistant Laminate Options
- Material-Specific Qualification
FR4 vs Rogers vs Ceramic PCB
Select specialized substrates when high-frequency performance, thermal conductivity, or electrical insulation exceeds your FR4 material requirements.
Cost-Effective General-Purpose Substrate
Use FR4 for control, power, and general digital circuits that can meet their electrical and thermal requirements with glass-epoxy laminates.
- Broad Multilayer Manufacturing Support
- Standard & High-Tg Material Choices
- Cost-Effective Volume Production
Low-Loss RF & High-Frequency Circuits
Choose suitable Rogers laminates for RF and microwave circuits requiring controlled dielectric properties and reduced signal loss.
- Low-Loss Laminate Options
- Controlled Impedance
- RF & Hybrid Stackups
High Thermal & Electrical Insulation Demands
Choose ceramic substrates for demanding heat dissipation, electrical insulation, and temperature-stability requirements.
- Alumina & Aluminum Nitride
- High Thermal Conductivity Options
- Specialized Metallization
FR4 PCB Assembly
Get your FR4 PCBs fabricated, assembled, and tested through one supplier. LZJPCB supports component sourcing, precision SMT, through-hole assembly, and quality testing from prototypes to mass production.
FR4 PCB Manufacturing & Assembly
Turn your FR4 bare boards into assembled PCBAs with component sourcing, precision placement, controlled soldering, and inspection matched to your product requirements.
- Fine-Pitch SMT & BGA Assembly — 01005 components and 0.35 mm BGA support
- Mixed-Technology Assembly — SMT and through-hole component placement and soldering
- Turnkey Component Sourcing — Full BOM procurement and approved alternatives
- PCBA Quality Inspection — 3D SPI, AOI and X-ray inspection
- Electrical & Functional Testing — Customer-defined test procedures and acceptance criteria
Get a FR-4 PCB
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FR4 PCB FAQs for Buyers and Engineers
Short answers to the material and sourcing questions that remain after capability review.
Upload your Gerber files, stackup, material requirements, and quantity. Receive a manufacturing scope with fixed pricing and lead time.
