Custom Rogers PCB
Manufacturing
Specify your Rogers laminate series, revision, and RF stack-up. We review material supply, build feasibility, and verification requirements before returning a quote.
- Exact laminate grade & revision confirmed before quoting
- RF stack-up and impedance inputs reviewed with your build
- Material traceability and inspection records included
Rogers® is a registered trademark of Rogers Corporation. LZJPCB is an independent PCB manufacturer; no affiliation or authorization by Rogers Corporation is implied.
Does Your PCB Need a Rogers Laminate?
Rogers laminates are brand-specified or performance-derived. Confirming which path applies determines material, supply, and approval scope.
Path A
Customer-Nominated Material
Your design file, BOM, or customer approval references a specific Rogers part number or revision.
What we need:
- Exact Rogers P/N & revision
- Approved equivalent policy
- Customer sign-off path
Next step:
Confirm grade → Section 3 -- Material Identification
Path B
Performance-Defined Material
Your spec defines frequency, insertion loss, Dk, or thermal targets -- no brand locked yet.
What we need:
- Target frequency / loss
- Impedance & Dk targets
- Environment & certifications
Next step:
Material fit review → Contact our engineers
Not sure Rogers is necessary for your application? FR4 variants, ceramic-filled, or other high-frequency laminates may meet your performance targets at lower cost and lead time.
Specify the Exact Rogers Material and Revision
"Rogers PCB" covers dozens of distinct laminates across multiple series. An incomplete material name changes the quote, the supply path, and the acceptance criteria. Confirm the full specification before build review begins.
Required to Confirm Before Quoting
-
Rogers series name
e.g. RO4000®, RT/duroid®, RO3000®, CLTE-XT™, TC Series™
-
Specific grade / part number
e.g. RO4003C™, RO4350B™, RO3003™
-
Dielectric thickness
As published in the manufacturer's data sheet for the revision
-
Copper cladding type & weight
Rolled / Electrodeposited; ½ oz / 1 oz / 2 oz
-
Core vs. prepreg / bonding film designation
Where mixed constructions or hybrid builds apply
-
Data sheet version / revision date
Source: Rogers Corporation official published document
-
Approved equivalent policy
Customer approval required before any alternate laminate
Material Reference Table
| Series | Common Grades | Typical Application Zone |
|---|---|---|
| RO4000® | RO4003C™ RO4350B™ |
RF / Microwave / Antenna |
| RT/duroid® | 5880 / 5870 | Microwave / mm-wave |
| RO3000® | RO3003™ | High-frequency low-loss |
| CLTE-XT™ | -- | High-speed / low Df |
| TC Series™ | TC350™ | High-power / thermal |
All Dk/Df values sourced from Rogers Corporation official data sheets. Confirm revision and test conditions with your project specification before use in stack-up calculations.
Build the RF Stack-Up Around the Material
The laminate grade sets the electrical foundation. Every other build variable -- copper weight, dielectric thickness, impedance target, surface finish, and layer sequence -- must be confirmed against it before manufacturing begins.
Annotated RF Stack-Up
Surface Finish
ENIG / HASL / OSP
Signal Layer Cu
Weight / roughness
Rogers Laminate Core
Dk / Df -- per datasheet + conditions confirmed before use
Reference / Ground Plane
Stack-up definition
Bonding Layer / Prepreg
If mixed or multilayer build
Further Signal / Ground Layers
Per layer count
Impedance Target
Defined by customer / verified via coupon
Frequency Range
Customer-defined; informs Dk selection
RF Build Input Matrix
| Input | Source | Status |
|---|---|---|
| Rogers grade & revision | Customer BOM/spec | Required upfront |
| Dk value used | Official datasheet | Confirm revision |
| Dielectric thickness | Customer / stackup | Required |
| Copper weight | Customer spec | Required |
| Copper roughness | Manufacturer data | Eng. review |
| Impedance target | Customer spec | Required |
| Impedance coupon | Build agreement | Confirm method |
| Surface finish | Customer spec | Required |
| Frequency range | Customer spec | Informs Dk use |
| Mixed-material layers | Customer stackup | Eng. review |
RF layout, simulation, and circuit design are outside our manufacturing scope. Stack-up and impedance inputs are reviewed as part of DFM -- not independently designed.
Request an RF Stack-Up ReviewCheck Supply and Manufacturing Fit
Rogers laminates have real procurement lead times, minimum order quantities, and storage requirements. Manufacturing compatibility depends on the full build -- not just the laminate grade. Check both before committing to a schedule.
Material Supply
- Procurement lead time varies by grade, thickness & copper
- MOQ applies; panel utilization affects cost
- Lot traceability required
- Storage conditions maintained per manufacturer spec
Manufacturing Compatibility
- Drilling, routing & copper compatible with Rogers grades
- Mixed FR4/Rogers builds need specific bonding film review
- Controlled impedance lines need coupon design & process confirmation upfront
Confirmed
Grade in scope; standard build; supply confirmed
Engineering Review
Mixed build, unusual thickness, or tolerance interaction to review
Material Approval
Equiv. or alternate laminate needs customer sign-off
Out of Scope
Grade not available; build beyond process capability
Verify Material Identity and RF Requirements
Confirming a Rogers laminate is in the board requires more than a mill cert. Define the verification method, record, and acceptance standard for each requirement before the order begins.
| Requirement | Method | Record | Acceptance Basis |
|---|---|---|---|
| Material identity (grade & revision) |
Incoming lot inspection; label vs. datasheet | Rogers CoC; lot label; incoming record | Matches specified grade, revision & thickness |
| Dielectric thickness and layer build |
Cross-section / SEM after lamination | Sectioning report; layer stack photo | Within laminate and build drawing tolerance |
| Controlled impedance | TDR on dedicated impedance coupon | Impedance test report; coupon ID linked to panel | Customer-specified target ± agreed tolerance |
| Copper weight & plating thickness |
Cross-section; measuring inspection | Sectioning photo; plating report | Per IPC class and customer drawing |
| Electrical continuity and isolation |
Flying probe / fixture test | E-test pass/fail report per panel | 100% net continuity per design netlist |
| Dimensional compliance | CMM / optical inspection | Dimensional report; drill file correlation | Per drawing tolerances |
| Special RF / customer requirements |
As defined in customer specification | Customer-agreed format | Customer-defined acceptance criteria |
Note: Specific test coverage, equipment location, and report formats are confirmed during order review. Additional RF testing (e.g., vector network analysis, loss measurement) is outside standard scope unless agreed in writing before production.
See Evidence Behind Rogers PCB Production
Supplier capability claims are not production evidence. The chain from material lot to shipped board must be visible and documentable -- not assumed from a brand name on a website.
Material Lot
Lot label · CoC
Rogers grade
Thickness · copper
Incoming Inspection
Label vs. datasheet
Grade · revision
Thickness · copper
Build Revision
Stack-up · EQ
version record
Process & Inspection
Cross-section · plating
E-test · dimensional
AOI results
Impedance Coupon
TDR test · report
Coupon ID linked
to production panel
Shipment Record
Order · lot · CoC
delivery documentation
Material Lot Records
Incoming lot label, Rogers CoC and revision matched to purchase order before production
Cross-Section Evidence
Post-lamination sectioning shows layer identity, thickness and copper weight
Impedance Test Report
TDR coupon results linked to panel ID, per customer impedance target and tolerance
Electrical Test Records
100% E-test pass / fail record per panel; netlist continuity confirmed
Repeat Build Version Control
Build revision and lot-to-lot process consistency records for repeat orders
Manufacturing Location
Production site, process ownership and subcontract scope confirmed
Evidence availability is subject to customer confidentiality agreements and order scope. Samples of redacted records can be discussed during order review.
Request Supporting EvidenceWhat Determines Rogers PCB Cost and Lead Time?
Rogers laminates carry material procurement lead times and minimum quantities that do not apply to standard FR4. Understanding the drivers before quoting avoids scope changes, schedule pressure, and unplanned cost increases.
1 Material procurement is the first constraint.
Rogers grades are not warehouse stock items. Procurement lead time, panel size, and lot MOQ directly affect project schedule and unit economics -- especially at prototype and small-series quantities.
2 Build complexity compounds cost.
Mixed Rogers/FR4 constructions, tighter impedance tolerances, special copper weights, and non-standard finishes each add engineering review time, process steps, and potential yield impact.
3 Verification adds defined cost -- not optional overhead.
Impedance coupon design, cross-sectioning, and customer-specific inspection records are build cost inputs, not post-production extras. Confirm scope at RFQ to avoid surprises.
Cost and Lead Time Driver Matrix
| Driver | Impact on Cost / Lead Time |
|---|---|
| Rogers grade & revision | Sets procurement path and MOQ |
| Material availability | Procurement lead time: varies by grade |
| Panel utilization | Lower utilization → higher unit cost |
| Layer count | Adds lamination cycles and alignment |
| Mixed construction | Engineering review + bonding film cost |
| Copper weight | Material cost + process step impact |
| Impedance coupon scope | Additional test coupon design |
| Surface finish | ENIG / specialty finish vs. HASL |
| Verification scope | Cross-section, report, CoC scope |
| Order quantity | MOQ amortization across panels |
| Rush / expedite request | Available subject to schedule; discuss |
No fixed price list or standard lead time is published for Rogers PCB. Each project is quoted on confirmed material, build, quantity, and verification scope.
Rogers PCB Questions Before You Request a Quote
Four questions that redirect to the right page -- or confirm you're in the right place.
What is the difference between a Rogers PCB and a High-Frequency PCB?
"Rogers PCB" refers to boards manufactured using a Rogers Corporation branded laminate -- RO4003C™, RO4350B™, RT/duroid® 5880, or similar.
"High-Frequency PCB" describes boards optimized for RF or microwave performance -- which may use Rogers laminates, competitive materials, or advanced FR4 depending on the application and specification.
This page covers Rogers brand laminates, specific grades, and their manufacturing path. Performance-defined and multi-material RF builds are covered on the High-Frequency PCB page.
Can Rogers laminates be combined with FR4 in the same board?
Mixed constructions are technically possible but require specific bonding films, lamination process adjustment, and engineering review before acceptance. Not all grade and thickness combinations are compatible with standard FR4 layer constructions.
Submit your stack-up for engineering review before committing to a mixed build schedule.
Can an equivalent high-frequency laminate be substituted for Rogers?
Only with documented customer approval. Rogers grade, revision, and sourcing must match the design specification unless a qualified equivalent is approved in writing by the responsible design authority.
We do not substitute materials without prior written customer approval.
Does this page cover RF layout design, assembly, or prototype services?
No. This page covers Rogers laminate selection, supply confirmation, bare board manufacturing, and verification for completed design files.
- → RF circuit design and simulation -- PCB Design
- → Component assembly -- PCB Assembly
- → Prototype-specific services -- PCB Prototype
Still not sure which page applies?
Request an RF Material ReviewRequest a Rogers PCB Quote or RF Material Review
Choose the path that matches where your project is today.
Request a Rogers PCB Quote
Use this path when:
- Rogers grade and revision confirmed
- Stack-up and impedance defined
- Design files available or in preparation
What to include:
- ☐Rogers P/N, grade & revision
- ☐Stack-up / layer count
- ☐Impedance targets & coupon need
- ☐Board dimensions
- ☐Copper weight & surface finish
- ☐Quantity and target delivery date
- ☐Verification / inspection scope
- ☐Gerber / ODB++ / drill files (or confirm file status)
Request an RF Material / Stack-Up Review
Use this path when:
- Material not yet confirmed
- Stack-up or Dk/Df targets unclear
- Mixed construction needs review
- Evaluating Rogers vs. equivalent
What to include:
- ☐Frequency range and loss targets
- ☐Preliminary stack-up or layer count
- ☐Any Rogers or material references
- ☐Application context
- ☐Current design file status
We will return a material and build gap list -- not a price -- as the first response.
All submitted information is treated as confidential and used only for project evaluation. Rogers® is a registered trademark of Rogers Corporation. LZJPCB is an independent PCB manufacturer. No authorization, partnership, or affiliation with Rogers Corporation is implied or claimed.
Response to quote requests and material reviews is subject to engineering availability and project scope. No fixed response time is guaranteed.