Flex PCB Manufacturer
LZJPCB manufactures custom flexible printed circuit boards in controlled Polyimide, PET and LCP material routes, from 1–8 layers and 0.06–0.4 mm finished thickness. Send the bend, coverlay, stiffener and assembly requirements for one build-ready quotation.
- Since 2006
- 1–8 Layer FPC
- 0.06–0.4 mm
- 100% Electrical Test
Custom Flex PCB Manufacturing Capabilities
These published limits let engineering and purchasing qualify the build before RFQ. The released quotation locks the exact material code, stackup, copper, coverlay, stiffener, inspection and calendar ship date.
| Parameter | Published / quoted range | Release requirement |
|---|---|---|
| FPC layer count | 1–8 layers | Layer order and flex-zone stack identified |
| Finished thickness | 0.06–0.4 mm | Finished total and local stiffened thickness stated |
| Minimum trace | 2 mil FPC capability | Trace/space class confirmed by DFM |
| Mechanical drill | 0.10 mm published PCB capability | FPC via construction approved for the stack |
| Copper | Project-specific rolled or electrodeposited copper | Copper type and weight matched to bend duty |
| Base film | Polyimide; PET or LCP by named material route | Exact supplier code and thickness on quote |
| Coverlay | Polyimide film and adhesive construction | Opening, web, registration and bend area released |
| Stiffener | Polyimide or FR4 reinforcement | Material, thickness, adhesive and location released |
| Surface finish | Selected to pad, connector and assembly requirement | Finish type and contact area shown in fabrication data |
| Testing | 100% electrical test; AOI and X-ray in the control route | Added reliability evidence named before order |
Flex PCB Types & Layer Structures
Select the lowest-complexity construction that completes routing, bend duty, connector support and assembly. The cards below separate true flexible circuits from adjacent structures that need their own released process.
Single & Double-Sided Flex PCB
Single-sided FPC carries one copper layer for simple interconnects. Double-sided FPC adds a second copper layer and plated interconnection for denser routing while keeping a thin flexible body.
Multilayer Flex PCB
Multilayer flex combines three or more copper layers for routing and shielding in a compact envelope. A four-layer build is released with the copper, dielectric, coverlay and local stiffener stack fully defined.
HDI Flex PCB
HDI flex uses a controlled high-density buildup when package escape or routing density exceeds a standard FPC structure. The quotation names every microvia layer pair, capture land, fill requirement and lamination stage; no microvia geometry is assumed from the page.
Ultra-Thin & Thin Flex PCB
LZJPCB’s published FPC thickness range starts at 0.06 mm and extends to 0.4 mm. The released thickness includes the specified copper, dielectric and coverlay; connector and component areas receive local reinforcement when the drawing calls for it.
Transparent & Clear Flex PCB
A transparent or clear flex circuit requires an optically suitable substrate, adhesive and conductor layout. Send the optical target and environmental condition; the quotation identifies the exact released material code or declines the construction when no controlled supply route exists.
High-Current & Heavy-Copper Flex PCB
High-current flex is sized from copper cross-section, temperature rise, bend radius and movement count. Heavy copper increases stiffness and copper strain, so dynamic bend zones use a released copper weight and geometry instead of the generic rigid-PCB copper limit.
Specialty Flex PCB Options
Shielded, sculptured, flat, long, micro and strip-format flexible circuits are quoted from a drawing that defines the special feature. ACF bonding and controlled cut or thinned regions enter the build only after material and process review.
Semi-Flex PCB
Semi-flex uses a controlled thin or routed zone in a rigid-board material system to support a limited bend during installation. It is not a dynamic polyimide FPC. LZJPCB quotes this structure only after the bend angle, flex count, residual thickness and released fabrication route are confirmed.
Flex PCB Materials
Material selection starts with temperature, bend duty, dimensional stability, electrical performance and the supply code required for repeat production. The quotation names the actual laminate or film; a generic family name is not a material release.
Polyimide & Kapton Flex PCB
Polyimide is the core material family for heat-resistant flexible circuits. Kapton is a branded polyimide film name, not a synonym for every polyimide construction. The build record names the actual base film, adhesive system, thickness and copper type.
LCP & PET Flex PCB Materials
LCP targets low moisture uptake and controlled electrical performance. PET targets cost-sensitive, lower-temperature circuits. Send the environment, assembly process and electrical target; the quote identifies the accepted material code and supply route before tooling.
Flex PCB Coverlay & Stiffener Options
Coverlay protects flexible copper; stiffeners support connectors, pads and components. Both are defined by material, thickness, adhesive, location and opening geometry in the fabrication drawing.
Flex PCB Stiffeners
Polyimide stiffeners control local thickness with limited added rigidity. FR4 stiffeners support connectors, component zones and insertion areas. The drawing sets outline, thickness, adhesive, tolerance and distance from the active bend.
- Place the stiffener edge outside the active bend transition.
- State the final connector-area thickness.
- Define adhesive and registration tolerances.
- Add support beneath heavy components and contact fingers.
Flex PCB Coverlay
Polyimide coverlay protects conductors while keeping the circuit flexible. Openings are engineered for pads, fingers and assembly access; webs and registration are checked at narrow features before release.
- Provide pad and finger opening geometry.
- Keep coverlay transitions smooth through bend areas.
- Control adhesive squeeze-out at fine openings.
- State exposed copper and surface-finish areas.
Flex PCB Thickness, Copper & Via Specifications
Thickness, copper and vias are one mechanical system. The approved stack balances electrical current, routing density, flex-zone strain and component support.
Flex PCB Thickness
LZJPCB’s published finished FPC range is 0.06–0.4 mm. The quotation states the total flexible thickness and every local reinforced thickness; it also identifies the measurement location and tolerance.
Base film, copper, adhesive and coverlay form the moving region.
Stiffness changes are kept outside the active bend and tapered by geometry.
Local stiffener creates the required insertion or assembly thickness.
Flex PCB Copper Thickness & Via Options
Rolled or electrodeposited copper, copper weight, plated holes and blind or buried interconnects are released for the actual bend duty. Vias stay outside dynamic bend zones, with teardrops and local reinforcement used where the design calls for them.
Flex PCB Design & DFM
A flex DFM review converts use conditions into build rules before tooling. Send the intended motion, bend radius, installed shape, connector thickness and assembly process with the fabrication data.
Flex PCB Design & DFM Guidelines
Route traces perpendicular to the bend, spread them evenly, avoid abrupt width changes and keep vias, pad edges and stiffener transitions outside the active bend. The released DFM sets the copper-to-edge, coverlay opening, annular ring and tooling limits.
- State static or dynamic bend, radius and target cycles.
- Use curved routing and staggered conductors through the bend.
- Balance copper across layers and avoid I-beam stacking.
- Add teardrops and strain relief at pad transitions.
- Show every stiffener and coverlay opening in fabrication data.
KiCad Flex PCB Design
Use KiCad to separate the board outline, flex zone, stiffener outlines, coverlay openings and bend notes into unambiguous manufacturing layers. Export Gerber or ODB++, NC drill, IPC-356 netlist, stackup and a fabrication drawing from the same released revision.
- Name each non-copper manufacturing layer clearly.
- Add bend direction, radius and static/dynamic classification.
- Dimension connector-area and stiffened thickness.
- Verify plot origin, units, apertures and drill alignment.
- Attach a readme that maps every file to its purpose.
Flex PCB Applications
Flexible circuits replace discrete wiring, fold electronics into limited space and connect moving or offset assemblies. The application defines the bend, reinforcement, shielding, material and test plan.
Flexible LED PCB
Flexible LED circuits wrap lighting around curved housings and narrow channels. The build is sized for LED current, copper temperature rise, heat transfer, bend geometry, pad support and the assembly profile.
Flexible Circuit Cables & Harnesses
A flexible circuit cable replaces point-to-point wires with a repeatable flat routing pattern. Connector fingers, shielding, impedance, branch geometry, stiffeners and final installed shape are controlled in one fabrication drawing.
Flex PCB Prototype & Quick Turn
Prototype the production-intent material, copper, coverlay, stiffener and bend construction. One complete data package produces a DFM-approved build and a quotation with a fixed calendar ship date.
Flex PCB Prototyping
The prototype validates fit, connector thickness, bend behavior, assembly support and electrical function using the released construction. Production changes are documented as a new revision, not folded into the lot silently.
Fabrication files, stack, bend, stiffener, coverlay and quantities.
All flex-zone and manufacturability questions are resolved.
AOI, dimensional checks and 100% electrical test complete release.
Quick-Turn Flex PCB
Quick-turn starts after DFM, exact material availability and the released stack are confirmed. The commercial offer states one calendar ship date tied to that construction; rigid-board hour claims are not reused for flex builds.
No open material, bend, coverlay or stiffener decisions.
Material and tooling route are reserved for the build.
The quotation names the committed ship date.
Flex PCB Quality Control & Reliability
The control plan follows the circuit from incoming film and copper through imaging, lamination, coverlay, stiffener bonding, profile, electrical test and final inspection. Added bend or environmental evidence uses the method and acceptance limit stated on the order.
Base film, copper, adhesive, coverlay and stiffener match the released traveler.
Line/space, registration and copper geometry receive controlled inspection.
Opening, adhesive, edge position and reinforced thickness match the drawing.
Specified plated and hidden interconnects follow the approved inspection route.
Outline, slots, finger geometry and critical stiffened areas are verified.
Every finished board receives electrical test and final visual inspection.
Why Choose LZJPCB for Flex PCB Manufacturing
One controlled flex-zone definition follows the project from bend input through coverlay and stiffener tooling to final dimensional and electrical release.
Flex reliability depends on details that generic capability lists do not show. LZJPCB links the intended movement to the released drawing, production tooling and inspection record.
Engineering records the static or dynamic bend, radius, installed shape, copper direction and keep-out zones before tooling.
Openings, webs, adhesive, reinforcement outline and connector-area thickness are released on one revision-controlled drawing.
Finished thickness, alignment, outline and continuity are checked against the approved construction before shipment.
Flex PCB Case Studies
A valid case record states the flex stack, bend use, copper, coverlay, stiffener, critical risk, inspection and measured result. The modules below reserve that structure without inventing customer data.
Publish an authorized build with thermal, current and installed-bend evidence.
Publish an authorized build with contact geometry, stiffener and installed-shape evidence.
Publish an authorized multilayer FPC build with routing, registration and bend evidence.
Flex PCB Cost & Pricing
Flex PCB price is calculated from the released material and process route. Layer count, outline, panel use, copper, coverlay, stiffeners, finish, testing, quantity and assembly define the quoted total.
Eight inputs that control the price
Give every supplier the same construction so quotations remain technically comparable.
“Cheap flex PCB” is not a technical specification. Reduce cost by simplifying the stack and panel shape while preserving bend reliability and assembly support.
- Use the lowest layer count that completes routing.
- Consolidate stiffener materials and thicknesses.
- Keep coverlay openings manufacturable and repeatable.
- Quote prototype and annual volume in the same RFQ.
- Separate required evidence from optional reports.
Flex PCB Assembly & Soldering
Assembly is released with the same flex stack, stiffener, panel support and revision as the bare board. Fixtures keep the circuit flat while solder paste, placement, reflow and inspection protect flexible areas from heat and mechanical strain.
Flex PCB Assembly
LZJPCB’s published PCBA capability supports 01005 components, 0.35 mm BGA, POP, 3D SPI, AOI and X-ray. The assembly package includes BOM, CPL, stencil data, polarity, panel support, test coverage and acceptance limits.
- Carrier tooling supports the flexible panel during printing and placement.
- Component zones use the released local reinforcement.
- AOI checks visible joints; X-ray checks hidden connections.
- Functional testing follows stated fixture and acceptance criteria.
Flex PCB Soldering
The soldering route controls fixture support, paste volume, reflow profile, hand-solder dwell and cooling. Operators handle the board by supported areas and keep bending force away from hot pads and component terminations.
- Use the approved material-specific thermal profile.
- Support the circuit flat through soldering and inspection.
- Keep manual iron time and contact force within the work instruction.
- Do not fold or flex the board while solder joints remain hot.
- Inspect pad lift, coverlay edge and local deformation before release.
Get a Flex PCB Quote
Send one complete data package. The returned quotation states the accepted flex construction, material code, copper, coverlay, stiffener, inspection, quantity price and fixed calendar ship date.
Inputs required for a costed FPC build
Complete inputs remove hidden assumptions and keep supplier quotations comparable.
- Gerber / ODB++ and NC drill files
- Layer count and finished flex thickness
- Material family and exact code when mandated
- Copper type and weight
- Coverlay material, openings and thickness
- Stiffener material, outline and final local thickness
- Static or dynamic bend, radius and cycle target
- Board outline, panel format and surface finish
- Prototype and annual production quantities
- Electrical, dimensional and reliability evidence
- BOM, CPL, solder profile and test plan for assembly
Frequently Asked Questions About Flex PCB
Direct answers for material and structure selection, tied to the released fabrication data.
What Is a Flex PCB?
A flex PCB, or flexible printed circuit board, uses conductive copper on a flexible dielectric film so the circuit can bend, fold or fit a three-dimensional assembly. A complete build defines the material, layer stack, copper, coverlay, stiffeners, bend area and electrical test.
Is FR4 Used in Flex PCBs?
The flexible region of a true FPC uses a flexible film such as Polyimide, PET or a released LCP construction. FR4 is used as a local stiffener beneath connectors or components, or as the rigid region of a separate rigid-flex design. FR4 does not replace the moving film in a dynamic flex zone.
Review FR4 PCB Review rigid-flex PCBWhat Is Flex-Cut PCB?
Flex-cut describes a controlled cut, routed or thinned structure intended to create a limited flexing region in a defined material system. It is not automatically equivalent to a standard Polyimide FPC. The drawing must state the material, residual thickness, cut geometry, bend angle and flex count before the process can be accepted.
Swipe horizontally to compare all columns.
| Decision | Flex-Cut / Semi-Flex | Standard Polyimide FPC |
|---|---|---|
| Flexible region | Controlled routed or thinned zone in a defined rigid material system | Flexible dielectric film forms the circuit body |
| Movement | Limited installation bend | Static or dynamic bend by released construction |
| Release input | Residual thickness, cut geometry, bend angle and flex count | Film, copper, coverlay, radius, motion and reinforcement |
| Selection | Choose only when the installation and process route are verified | Choose for true flexible interconnect requirements |
Send the fabrication data, material, layer count, thickness, copper, coverlay, stiffener, bend condition, quantity and assembly files.