Custom Aluminum
Nitride PCB
Manufacturing
High-thermal AlN ceramic substrates with full in-house circuit process -- DBC, DPC, AMB, Thick Film, Thin Film, LTCC and HTCC available
Designed for high power density, tight CTE matching and demanding electrical isolation. Engineering review included from prototype to production.
Does Your Thermal Design
Need AlN?
AlN delivers superior thermal conductivity and electrical isolation. But the right material decision depends on your complete thermal path -- not a single parameter.
AlN is likely the right choice if:
- Thermal conductivity requirement exceeds 80 W/m·K
- Power density is high and junction temperature is critical
- Electrical isolation must be maintained at high voltage
- CTE matching to silicon or GaN devices is required
- Operating temperature exceeds 200°C continuously
- Substrate must remain stable under thermal cycling
- RF or microwave performance requires low dielectric loss
- System reliability qualification requires documented material traceability
Note: If fewer than four conditions above apply to your design, Alumina or Metal Core PCB may deliver sufficient performance at lower cost and shorter lead time. Review the alternatives before specifying AlN.
Thermal Requirement Below 40 W/m·K?
Alumina (Al₂O₃) covers most power, LED and industrial applications at lower cost and faster lead time.
Explore Alumina PCBStandard Power LED or Industrial Application?
Metal Core PCB (MCPCB) offers simpler processing and lower cost for applications within standard thermal limits.
Explore Metal Core PCBAluminum Base with Dielectric Layer?
Aluminum PCB uses a metal base with dielectric coating -- a different architecture from AlN ceramic. Not interchangeable.
Explore Aluminum PCBUnsure whether AlN fits your thermal budget?
Request an AlN Fit Review
Define the AlN Material
and Circuit Process
AlN substrate selection and circuit process must be defined together. Grade affects thermal performance and surface condition; process route determines copper adhesion, line resolution and reliability ceiling.
AlN Material Grade Comparison
| Parameter | Standard AlN | High-Purity AlN |
|---|---|---|
| Thermal Conductivity | ~140 W/m·K | ~170 W/m·K |
| Electrical Resistivity | Very High | Very High |
| CTE | ~4.5 ppm/°C | ~4.5 ppm/°C |
| Surface Condition | Standard sintered | Precision lapped |
| Dielectric Loss | Low | Very Low |
| Typical Use | Power modules, EV inverters | RF, microwave, precision assemblies |
| Relative Cost | Moderate | Higher |
Grade selection is driven by your thermal budget, surface flatness requirement and circuit resolution. We advise based on confirmed design inputs -- not catalogue defaults.
Direct Bonded Copper
Copper foil directly bonded to AlN at high temperature using a eutectic bonding process.
Typical Applications
Direct Plated Copper
Copper deposited via sputtering and electroplating on AlN for fine-pitch circuit definition.
Typical Applications
Active Metal Brazing
Active metal brazing for maximum copper-to-AlN adhesion and highest reliability ceiling.
Typical Applications
Thick Film
Conductive paste screen-printed and fired onto AlN for hybrid circuit integration.
Typical Applications
Thin Film
Vacuum-deposited metal on precision AlN surface for highest line resolution and RF performance.
Typical Applications
LTCC
AlN-compatible multilayer co-fired at low temperature for 3D integration.
Typical Applications
HTCC
High-temperature co-fired AlN multilayer for hermetic packaging and extreme reliability.
Typical Applications
Need help confirming grade and process route?
Request an AlN Material and Process ReviewThermal Stack -- Top to Bottom
Close the Complete Thermal
and Mechanical Path
AlN thermal conductivity only delivers value when every interface in the path is correctly defined. A single poorly specified interface can eliminate the thermal advantage of the substrate.
Device-to-Substrate Interface
Define die attach method -- solder, sintered silver or adhesive. Each has different thermal resistance, CTE compliance and reliability ceiling. We review the substrate surface condition for your attach method.
Copper and Metallization Layer
Copper weight, pad geometry, line width and surface finish (Ni/Au) must match process route design rules. Reviewed against your current and thermal cycling load.
Substrate-to-Heatsink Interface
AlN flatness, surface finish and mounting method affect TIM performance and thermal resistance. Clamping force and housing material reviewed for CTE mismatch risk.
Mechanical and CTE Stack
AlN CTE (~4.5 ppm/°C) must be compatible with adjacent materials. Thermal cycling range, mounting constraints and edge conditions reviewed at DFM stage to prevent cracking.
Important: AlN is brittle. Point loads, edge chips and CTE mismatch under cycling are the primary failure modes. All interface conditions must be reviewed before design is finalised.
Resolve AlN Manufacturing
and File Risks
AlN is harder to machine, more brittle and more sensitive to process variation than Alumina. Every geometry, edge and file condition must be reviewed before production starts.
Manufacturing Risk Register
Brittleness and Point Load
AlN cracks under localised mechanical stress. Mounting hole position, edge chamfer and handling method reviewed at DFM stage before panel layout is confirmed.
CTE Mismatch Under Thermal Cycling
CTE difference between AlN, copper and device stack must be evaluated against your thermal cycle range. Mismatched stack leads to delamination or substrate cracking.
Edge and Slot Quality
Laser cutting and dicing produce different edge profiles. Edge type, corner radius and slot tolerance must be specified in design files and confirmed at EQ.
Copper and Metallization Adhesion
AlN requires process-specific surface preparation for copper bonding. DBC, DPC and AMB each have different adhesion mechanisms and peel strength conditions reviewed per application.
Flatness and Bow
AlN substrate flatness affects TIM contact, device attach yield and housing assembly. Thickness and panel size reviewed against tolerance at DFM.
Version and Change Control
Any geometry, material or process change after EQ approval requires a new EQ cycle. Revision numbers must be carried in all design files.
File and Design Requirements
Accepted File Formats
Gerber / DXF / DWG / PDF with complete layer stack description
Required Design Inputs
- Board outline with datum reference
- Layer stackup and drill/slot table
- Copper weight per layer
- Surface finish specification
- Edge type and corner radius
Version Control Requirements
All submitted files must carry revision number. Post-EQ changes require written notification and new approval cycle.
Packaging and Handling Specification
Specify fragile marking, foam or tray packaging, ESD protection class and any special carrier requirements for AlN substrates.
Submit your files for DFM review
Send Requirements for Review
Verify AlN Material, Insulation
and Reliability
AlN PCB verification covers material identity, geometry, copper adhesion, electrical isolation and -- where specified -- thermal and mechanical reliability. Scope is agreed before production starts.
| Verification Item | Method | Frequency | Acceptance Standard | Record |
|---|---|---|---|---|
| Material CoC | Supplier certificate review | Every batch | Grade, purity and thermal conductivity confirmed | CoC on file |
| Dimensional Inspection | CMM / optical measurement | 100% or AQL sample | Per drawing tolerance | Inspection report |
| Surface and Visual | Optical / visual check | 100% | No crack, chip, void, edge damage | Visual record |
| Copper Adhesion | Cross-section / peel test | Sample basis | Per process route spec | Test report |
| Electrical Continuity | Flying probe / bed of nails | 100% (where specified) | Per net list | Test report |
| Dielectric / Hi-Pot | Hi-pot test | Per order requirement | Per design voltage spec | Test record |
| Thermal Cycling | Per agreed standard | Project qualification basis | Per agreed cycle and ΔT range | Reliability report |
| Mechanical Shock / Vibration | Per agreed standard | Project qualification basis | Per agreed profile | Reliability report |
Reliability testing scope, sampling plan and acceptance criteria are defined at order acknowledgement or EQ stage. Non-conformance handling and corrective action procedure available on request.
Define your verification requirements
Discuss AlN Verification
See Evidence of Repeatable
AlN PCB Production
We document the material-to-board chain for every AlN order. Evidence covers substrate identity, process records, inspection results and repeat batch consistency.
Substrate Identity and Batch Records
AlN substrate sourced and logged by grade, thermal conductivity class and batch number. CoC provided for every production order.
Process Parameter Records
Key process parameters recorded at each stage -- bonding temperature, plating thickness, firing profile or deposition conditions depending on circuit route.
Inspection and Test Documentation
Dimensional, visual, electrical and isolation reports issued with each batch. Cross-section samples available for adhesion and layer review.
Repeat Batch Traceability
Repeat orders reference approved first article. Material, process and file changes are controlled and documented. Change history available on request.
Request supporting documentation
Request Supporting Evidence
What Determines AlN PCB
Cost and Lead Time?
AlN PCB cost and lead time are among the highest in the ceramic PCB category. Both are driven by material procurement, process complexity and quality requirements -- not by board count alone. The drivers below explain why two similar-looking AlN boards can differ significantly in price and schedule.
Cost and Lead Time Driver Matrix
| Driver | Impact on Cost | Impact on Lead Time |
|---|---|---|
| AlN grade / thermal class | Higher thermal conductivity grade = higher substrate cost | May extend material procurement lead time |
| Substrate thickness | Thicker = higher material cost; affects dicing yield | Standard thickness faster to procure |
| Board size / panel utilisation | Larger or irregular shape = lower utilisation = higher unit cost | Affects panel planning and laser cut time |
| Circuit process route | AMB and Thin Film higher NRE than DPC or Thick Film | Thin Film, LTCC and HTCC have longest process cycles |
| Copper weight and line spec | Heavier copper and tighter lines add process steps and cost | Adds DFM, EQ and plating time |
| Surface finish | Ni/Au standard; other finishes on request and project basis | Availability depends on process route |
| Quantity | Lower unit cost at volume; NRE and EQ amortised | Production run longer than prototype |
| Destructive testing | Cross-section and peel test consume boards from the batch | Adds sample preparation and analysis time |
| Reliability test requirements | Thermal cycling, shock and vibration add cost | Adds weeks to qualification schedule |
| Expedite | Subject to material availability and process capacity | Discuss at RFQ stage; not guaranteed |
Indicative Lead Times: AlN prototype lead time is typically 10-15 business days subject to substrate procurement. Production lead time is typically 4-6 weeks. Both are project-specific and confirmed at quote stage.
Ready to get a project-specific number?
Request an AlN PCB Quote
Aluminum Nitride PCB Questions
Before You Request a Quote
What is the difference between Aluminum Nitride PCB and Aluminum PCB?
These are entirely different products. Aluminum Nitride PCB uses AlN ceramic (Al₃N₄) as the substrate -- a non-metallic material with thermal conductivity of approximately 140-170 W/m·K and full electrical isolation. Aluminum PCB (MCPCB) uses a metal aluminum base with a dielectric coating layer, typically achieving 1-3 W/m·K. They are not interchangeable in design, process or application. If you are specifying a metal-base board, see our Aluminum PCB page.
Aluminum PCBHow do I decide between AlN and Alumina for my application?
If your thermal conductivity requirement is below 40 W/m·K, Alumina (Al₂O₃) is usually sufficient and offers lower cost and shorter lead time. AlN becomes necessary when power density is high, junction temperature is critical, CTE matching to silicon or GaN is required, or when electrical isolation must be maintained at high voltage under thermal cycling. We can review your thermal budget and advise on the right material path.
Alumina PCBWhich circuit process routes are available for AlN substrates?
We support all seven process routes on AlN substrates: DBC, DPC, AMB, Thick Film, Thin Film, LTCC and HTCC. The appropriate route depends on your required copper thickness, line resolution, operating temperature, CTE stack and reliability qualification level. We recommend based on confirmed design inputs -- not catalogue defaults.
Ceramic PCB -- Process RoutesDo you provide thermal simulation, device attach or PCB assembly on AlN PCB?
Our scope covers the AlN ceramic substrate and circuit layer. Thermal simulation, device attach, wire bonding and board-level assembly are outside our standard delivery boundary. If your project requires a path from substrate to assembled module, contact us to discuss requirements and referral options.
PCB AssemblyStill have a question about AlN?
Request an AlN Thermal Review
Request an AlN PCB Quote
or Thermal Review
Two ways to start -- depending on how complete your design and thermal path inputs are.
Your Design Is Defined
You have AlN grade, process route, geometry, thermal interface and file ready.
Recommended submission includes:
- AlN grade / thermal conductivity class
- Circuit process route
- Board dimensions and substrate thickness
- Copper weight and line specification
- Surface finish and metallization
- Mounting and device attach interface
- Quantity and target delivery date
- Design files (Gerber / DXF)
Your Thermal Target Is Defined, Design Is Not
You have power density, junction temperature or isolation targets but have not locked material, process or geometry yet.
Recommended submission includes:
- Application and operating environment
- Power dissipation and thermal load
- Junction or substrate temperature target
- Voltage isolation requirement
- Heatsink or housing interface condition
- Thermal cycling range (if known)
- Quantity estimate and timeline