SMT PCB Assembly Services
Precision SMT assembly for 01005, 0.35 mm-pitch BGA, QFN and double-sided boards. LZJPCB combines engineering review, controlled reflow and inspection from prototype to production.
- 01005 Component Assembly
- 0.35 mm-Pitch BGA
- 200M SMT Placements / Year
- 3D SPI, AOI & X-Ray Inspection
SMT PCB Assembly Capabilities
High-volume, double-sided, mixed and fine-pitch assembly for your PCB design.
High-Volume SMT Assembly
Automated placement and controlled soldering support consistent high-volume PCBA production.
- 200M SMT placements annually
- Automated high-speed placement
- 3D SPI and AOI inspection
Double-Sided SMT Assembly
Controlled placement and reflow protect components on both sides of your PCB.
- Double-sided component placement
- Controlled reflow soldering
- Second-side component support
Mixed SMT + Through-Hole
Coordinate SMT components, connectors and through-hole devices in one assembly build.
- SMT and THT assembly
- Wave and selective soldering
- Connector and terminal assembly
Miniature & BGA Assembly
Precision placement for 01005, QFN and fine-pitch BGA, with inspection matched to the build.
- 01005 component placement
- 0.35 mm-pitch BGA assembly
- Assigned X-ray for hidden joints
SMT PCB Assembly Process
See how stencil printing, component placement, reflow and inspection turn a bare PCB into an assembled board.
From Stencil to Shipment
Print paste through a precision stencil.
Check paste volume, height and alignment.
Pick and place each SMD on its pads.
Melt solder through a controlled heat profile.
Inspect visible joints and assigned hidden joints.
Test electrical and functional requirements as agreed.
Complete release checks and protective packaging.
SMT PCB Design and DFM Guidelines
Resolve placement, soldering and test-access issues before assembly starts.
SMT Assembly DFM Review
Review layout, BOM, footprints and assembly requirements to resolve manufacturing risks before release.
- Footprints and pad dimensions
- Placement clearance
- Fiducials and panelization
- Stencil and paste design
- BGA and QFN land patterns
- Test access and inspection scope
SMT Assembly Applications
Assembly for compact digital, industrial, wireless and power electronics.
High-Density Electronics
Fine-pitch ICs, BGA, QFN and miniature parts assembled with controlled reflow.
Industrial Control & Sensors
Accurate assembly of processors, analog devices and connectors for mixed-signal control boards.
Communication & IoT
Precision placement of RF modules and miniature components for compact wireless boards.
LED & Power Control
Polarity checks and controlled reflow support LEDs, power devices and heat-sensitive components.
SMT Assembly Quality Control and Testing
Inspect solder quality and verify the assembled board against the agreed test plan.
Verify the Assembled Board
3D SPI, AOI and assigned X-ray inspect solder quality. Electrical and functional tests follow the agreed plan.
- BOM, component polarity and first-article verification
- 3D solder paste inspection (SPI)
- Automated optical inspection (AOI)
- Assigned X-ray for BGA and hidden joints
- Electrical and functional testing to the agreed scope
- Defect tracking, rework and final inspection
Why Choose LZJPCB as Your SMT Assembly Manufacturer?
20 years of manufacturing experience, 50+ engineers and automated SMT lines support your build from prototype to repeat production.
Precision at Production Scale
Fine-pitch placement, engineering review and controlled production support your SMT build.
Matched stencil and placement control support fine-pitch packages, with assigned X-ray for hidden joints.
Resolve BOM, footprint and stencil issues before assembly.
High-speed lines combine 3D SPI and AOI, with X-ray assigned to the build.
SMT Assembly Project Examples
A fine-pitch assembly example showing component density, inspection and production results.
High-Density SMT and BGA Assembly
A 5,000-unit industrial-control build achieved 99.3% first-pass yield, with no hidden-joint defects found by X-ray.
- 01005 passives and 0.35mm-pitch BGA
- 2,400 placements per panel, 6 layers
- 3D SPI and AOI inspection
- X-ray verified, 99.3% first-pass yield
Get an SMT
Assembly Quote
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Frequently Asked Questions About SMT Assembly
Understand SMT assembly and how it differs from through-hole production.
What Is SMT Assembly?
SMT assembly uses Surface Mount Technology to place SMD components directly onto PCB pads and solder them through a controlled process. The populated result is a PCBA; SMT describes the assembly method, not the PCB laminate type.
SMT Assembly vs Through-Hole Assembly
SMT supports compact packages, high density and automated placement. Through-hole uses leads inserted through plated holes and suits many connectors, large power parts and mechanically loaded components. Mixed assemblies combine both when the design requires them.
Send your board files, BOM, centroid and test requirements.
