SMT PCB Assembly Services
LZJPCB provides surface-mount and SMD assembly for accepted 01005, 0.35 mm BGA, QFN, PoP, double-sided and mixed-technology builds. Controlled programs, 3D SPI, AOI, assigned X-ray and defined functional testing connect engineering samples to repeat production.
- 01005 components
- 0.35 mm BGA
- 200M SMT points / year
- 3D SPI + AOI + X-ray
SMT PCB Assembly Capabilities
Capability screening answers whether the accepted packages, board construction, placement route, inspection and production quantity fit the documented SMT process.
SMT Production & High-Volume Assembly
Repeat production uses released placement programs, feeder and material controls, process settings, in-process inspection, lot traceability and documented change approval.
- Program and revision control
- BOM and component-lot traceability
- Repeatable inspection gates
Double-Sided SMT Assembly
The accepted route identifies side order, thermal exposure, heavy or sensitive parts, support and handling, inspection access and second-side risks before release.
- Side A and Side B data aligned
- Thermal sequence documented
- Post-reflow inspection assigned
SMT & Through-Hole Mixed Assembly
Mixed PCBA combines surface-mount and leaded components under one process sequence. The quotation fixes which operations precede or follow THT work and how the final assembly is inspected.
- SMT and THT sequence
- Connector and large-part handling
- Final functional-test responsibility
BGA & Miniaturized SMT Assembly
Accepted BGA, QFN, 01005, 0.35 mm BGA and PoP packages receive package-specific stencil, placement, thermal and inspection controls, including assigned X-ray for hidden joints.
- Package and land-pattern review
- Paste and placement verification
- Named hidden-joint inspection
SMT PCB Assembly Process
The SMT process moves one released PCB and BOM package through paste printing, placement, reflow, inspection and test. Each stage generates a controlled input for the next gate.
Solder Paste Printing & SMT Stencil
The accepted stencil and paste route links aperture design, thickness, board finish, component packages, printing setup and 3D SPI criteria. Paste type and storage follow the approved process specification.
- Stencil revision linked to PCB
- Paste identity and handling recorded
- 3D SPI gate before placement
SMD Component Placement & Pick-and-Place
The placement program uses the approved BOM, centroid, package library, polarity data and reference designators. First-unit verification closes program and material errors before continued production.
- Feeder and part identity control
- Polarity and orientation verification
- Program revision traceability
SMT/SMD Soldering & Reflow Control
The reflow route controls thermal exposure for the accepted PCB, paste, components and double-sided sequence. Sensitive packages and special handling remain visible in the work instruction.
- Accepted thermal profile
- Side sequence and support method
- AOI and assigned X-ray after reflow
SMT PCB Design & DFM Guidelines
SMT DFM aligns pads, packages, spacing, fiducials, panelization, stencil, inspection and test access with the documented assembly process. It is a manufacturing review, not an unquoted complete PCB layout service.
| DFM area | Required design input | Review output |
|---|---|---|
| Footprints and pads | Package drawing, land pattern and polarity | Mismatch or risk action list |
| Spacing and access | Component courtyard, height and rework access | Assembly-clearance decision |
| Fiducials and tooling | Board and panel references, rails and holes | Accepted panelization inputs |
| Stencil | Aperture, thickness and package mix | Printing and paste-risk feedback |
| BGA and QFN | Land pattern, mask, via and inspection requirements | Assembly and X-ray plan |
| Testability | Test points, connector access and procedure | Accepted verification boundary |
SMT Assembly Applications
SMT suits assemblies that require compact packages, high placement density and repeatable automated production. Application acceptance still comes from the supplied electrical, thermal, mechanical and test requirements.
Fine-pitch ICs, memory, BGA/QFN and dense passive networks receive package-specific controls.
Processors, analog interfaces, sensors and connectors use controlled placement and functional limits.
Modules, RF-sensitive parts, antennas or connectors stay linked to approved placement and handling data.
Polarity, thermal interfaces, power devices and large components receive an accepted process sequence.
SMT Assembly Quality Control & Testing
SMT quality control verifies paste, placement, soldering, hidden joints, electrical function and final configuration at separate gates tied to the released assembly data.
Exact MPN, package, polarity and approved alternate status checked.
3D SPI records paste condition before placement continues.
Program, orientation and component identity verified.
AOI checks assigned visible placement and solder features.
Assigned X-ray checks accepted BGA, QFN and PoP joints.
Defined functional limits, quantity and records reconciled.
A finding is isolated, reviewed against the exact board and BOM revision, reworked only under an accepted instruction, then inspected and retested at the assigned gate.
- Reference designators identified
- Material and program versions linked
- Rework and repeat inspection recorded
- Final lot and test evidence reconciled
Why Choose Us as Your SMT Assembly Manufacturer
Evaluate an SMT supplier through package capability, DFM quality, program control, sourcing, process inspection, testing, traceability and repeat-production evidence.
Repeatable SMT assembly depends on one released data set connecting the BOM, centroid, stencil, placement program, reflow controls, inspection plan and approved first article.
SMT Assembly Case Studies
A publishable SMT case must identify the actual board, package mix, process route, detected defect, closed action and authorized result. This page does not fabricate those values.
The approved case links package complexity and production route to inspection evidence, issue correction and the customer-authorized result.
PCB type, component count, pitch, BGA/QFN and sidedness.
Stencil, placement, reflow, double-sided or mixed assembly.
SPI, AOI, X-ray, functional limits and traceability.
Approved correction and authorized production result.
Get an SMT Assembly Quote
Send one controlled SMT package. The quotation returns accepted files, sourcing responsibility, process and inspection scope, cost factors, price and fixed ship date.
SMT cost is driven by PCB, BOM, setup, placement count, package complexity, sidedness, inspection, testing, quantity and schedule.
- Gerber or ODB++ and fabrication drawing
- BOM with exact manufacturer part numbers
- Centroid or Pick-and-Place and assembly drawing
- Package details, polarity and special handling
- Sourcing model and production quantity
- Inspection, test and target schedule
Frequently Asked Questions About SMT Assembly
These answers define SMT and SMD, separate assembly technology from PCB construction and compare surface-mount with through-hole production.
What Is SMT Assembly?
SMT assembly uses Surface Mount Technology to place SMD components directly onto PCB pads and solder them through a controlled process. The populated result is a PCBA; SMT describes the assembly method, not the PCB laminate type.
SMT Assembly vs Through-Hole Assembly
SMT supports compact packages, high density and automated placement. Through-hole uses leads inserted through plated holes and suits many connectors, large power parts and mechanically loaded components. Mixed assemblies combine both when the design requires them.
Send the PCB files, BOM, centroid, assembly drawings, package requirements, quantity and test scope.