FR4 PCB
Manufacturer
LZJPCB is a PCB and PCBA manufacturer producing custom rigid FR4 boards from engineering prototypes to repeat production. We review laminate grade, Tg, stack-up, finished thickness, copper, surface finish and impedance requirements before release, giving procurement and engineering teams one controlled build package.
- Since 2006
- 50+ engineers
- 58,000 m²/month
- 100% electrical test
FR4 PCB Manufacturing Capabilities
You Can Qualify at a Glance
Screen the construction before RFQ. The approved fabrication drawing then becomes the controlled specification for production and inspection.
| Manufacturing item | LZJPCB capability | Buyer / engineering value |
|---|---|---|
| PCB layers | Prototype & special: 1–40 layers Volume production: 1–32 layers | Double-sided through high-layer-count rigid FR4 PCBs |
| FR4 materials | Standard FR4, High-Tg, halogen-free, RCC and mixed-material stack-ups | Material route matched to thermal, density and reliability requirements |
| Finished thickness | 0.20–17.50 mm | Thin modules, standard rigid boards and thick structural builds |
| Maximum board size | 650 × 2000 mm | Large industrial, power and equipment-control formats |
| Minimum trace / spacing | 3 / 3 mil | Fine routing and dense component fan-out |
| Minimum mechanical drill | 0.10 mm | Compact plated through-hole interconnects |
| Maximum copper thickness | Up to 12 oz | High-current and power electronics |
| Surface finishes | HASL, lead-free HASL, ENIG, immersion silver, immersion tin, OSP, hard gold and gold fingers | Finish selected for solderability, contact wear and storage |
| Advanced processes | Blind / buried vias, back drilling, embedded resistor / capacitor and stepped gold fingers | Complex interconnect, signal integrity and mechanical requirements |
| Production stages | Prototype, small batch and volume | One controlled route from validation to repeat production |
Capability values become an approved production specification
Engineering checks the Gerber files, stack-up, drill, dimensions, copper, tolerance, impedance and special process before release.
Need a capability answer?
Send the actual files for a yes/no manufacturability review.
Custom FR4 PCB Manufacturing
Without Guesswork
FR4 is not one universal laminate. We convert electrical, thermal and mechanical requirements into a controlled material, stack-up, copper build and finished-board specification.
FR4 Material, Laminate, Substrate and Core Options
A rigid FR4 PCB combines copper foil, cured glass-epoxy core and prepreg. LZJPCB records the selected material grade and construction in the approved stack-up so purchasing, engineering and production use one definition.
Standard FR4
General industrial, control, consumer and instrumentation boards.
High-Tg FR4
Higher thermal margin for demanding assembly and operating conditions.
Halogen-Free FR4
Selected when the product specification requires halogen-free material.
RCC / Mixed Stack-Up
Used where HDI or combined electrical performance needs another dielectric.
Choose FR4 PCB Thickness and Lock the Tolerance Before Production
Finished board thickness affects connector fit, rigidity, impedance and stack-up. LZJPCB supports FR4 PCB thickness from 0.20 mm to 17.50 mm. Nominal thickness and tolerance are controlled on the approved fabrication drawing.
- Thickness is measured during final inspection.
- Connector interfaces and card guides drive finished thickness.
- High-copper builds require stack-up balance review.
- Tight tolerance is confirmed before production release.
Select the Right FR4 Tg Class Without Confusing Tg with Operating Temperature
Tg is the glass-transition temperature of the laminate system. It is not the PCB's continuous operating-temperature rating. The released material must match the laminate datasheet, soldering profile, copper construction and product environment.
Laminate glass transition
Heat transfer through material
Complete product validation limit
General electronic products
Conventional assembly and thermal requirements with a verified supplier grade.
- Standard rigid PCB builds
- Common assembly profiles
- Cost-focused material route
Added process margin
Multilayer boards and projects with repeated thermal-cycle requirements.
- Multilayer stack-ups
- Lead-free assembly margin
- Improved thermal robustness
Demanding thermal exposure
Higher layer counts, demanding reflow cycles and elevated product environments.
- High-layer-count PCBs
- Multiple assembly cycles
- Higher thermal margin
Specify FR4 PCB Copper Thickness Correctly
Copper-clad FR4 describes laminate before circuit processing. Finished copper includes base copper plus deposited copper added during fabrication. Specify the finished requirement and any local heavy-copper area to prevent quotation and impedance errors.
Base copper
Copper foil supplied with the laminate.
Finished copper
Final copper after plating and processing.
Internal copper
Defined per inner layer in the stack-up.
LZJPCB range
Copper thickness up to 12 oz.
Double-Sided FR4 PCB for Cost-Efficient Interconnects
Copper circuitry on both sides is connected with plated through holes. It is the direct choice when one layer lacks routing space but a multilayer stack-up is unnecessary.
- ✓ Two routed copper layers
- ✓ Standard or High-Tg FR4
- ✓ Controlled thickness and copper
- ✓ Multiple supported surface finishes
- ✓ 100% electrical test
Routing
More space than single-sided
Cost
Avoids unnecessary multilayer build
Delivery
Rush builds from 12 hours
Rigid FR4 PCB Prototype Service with a Clear Route to Volume
Prototype orders have no minimum quantity. Files, stack-up and requirements are reviewed before release, then approved production records support repeat manufacturing.
Engineering prototype
Design validation, fit checks and first-article testing.
Rush references
2L: 12 hours · 4L: 24 hours · 6L: 48 hours for qualifying standard builds.
Pilot / small batch
Process confirmation, assembly trial and first production qualification.
Controlled inputs
Approved Gerber, drawing, stack-up, material and EQ responses.
Volume production
Stable repeat delivery against the frozen specification and process records.
Release control
Engineering changes are reviewed before they enter production.
Submit files
Gerber + drawing
DFM / CAM
Manufacturability
EQ closure
Specification lock
Production
Controlled build
Verify
Test + release
FR4 PCB Material Properties
That Affect Board Performance
FR4 performance belongs to the selected laminate grade and test conditions, not one universal number. Use each property to make a manufacturing decision.
How FR4 Epoxy Glass and Fiberglass Construction Supports Rigid PCBs
FR4 laminate combines woven glass reinforcement with a flame-retardant epoxy resin system. The glass provides rigidity and dimensional support. Cured resin binds and electrically insulates the structure. Copper foil is bonded to the laminate and patterned into conductive circuitry.
Core
Cured structural thickness between copper layers.
Prepreg
Resin-rich bonding layer cured during lamination.
Glass style
Influences resin content and dielectric spacing.
Complete stack-up
Controls thickness, impedance and mechanical balance.
FR4 Electrical and Dielectric Properties for Controlled Designs
FR4 insulates adjacent copper features and layers. Dielectric constant, dielectric thickness, copper geometry and test frequency all influence impedance. LZJPCB controls finished impedance to ±5% when the approved stack-up and coupon plan specify it.
- Use the selected laminate datasheet for Dk and loss data.
- Lock dielectric thickness in the approved stack-up.
- Define single-ended and differential targets on the drawing.
- Retain impedance test data with the production lot.
Document needed: selected laminate datasheet + controlled stack-up + test coupon requirement
FR4 Thermal Properties: Tg, Thermal Conductivity and Operating Temperature
These values answer different questions. Tg marks the laminate transition. Thermal conductivity describes heat transfer. Operating temperature is a product-level limit based on the complete design. Thermal claims therefore trace to the exact laminate datasheet.
FR4 Mechanical Properties that Protect Dimensional Stability
The glass-reinforced structure supports drilling, routing, assembly and service. Balanced copper distribution, symmetric stack-up and controlled lamination reduce bow, twist and registration risk.
Rigidity
Supports components and connectors
Registration
Controlled imaging and lamination
Mechanical fit
Thickness selected for enclosure
Assembly handling
Panel structure supports processing
FR4 Material Specifications and Datasheets You Can Verify
Every published value should trace to the laminate actually used. Request the document pack when Tg, Dk, loss, thermal performance, halogen content or flame rating is a design input.
- Laminate manufacturer and material grade
- Supplier technical datasheet
- Certificate of conformance or lot evidence
- UL / flame-rating evidence for selected material
- Approved stack-up and fabrication drawing
待补充｜Evidence before publication
Supplier datasheet covers, laminate grade list, UL file evidence and approved material certificates. Do not publish a universal FR4 property table without identifying the exact grade and test conditions.
Where FR4 PCBs Deliver the
Best Manufacturing Value
FR4 is the default rigid-PCB platform when a project needs mature fabrication, insulation, mechanical strength and broad stack-up flexibility without a specialized RF or ceramic substrate.
Telecommunications
Controlled-impedance multilayer boards, back drilling and dense BGA routing.
Medical Electronics
Documented material, traceability and manufacturing under ISO 13485 controls.
Automotive Electronics
FR4 PCB manufacturing supported by IATF 16949 quality management.
Industrial Control
Rigid boards, heavier copper options and long-term repeat-production records.
Instrumentation
Fine routing, stable construction and controlled electrical verification.
Smart and Wearable Electronics
Thin rigid FR4 builds, compact routing and prototype-to-volume support.
FR4 PCB Standards and
Flame-Retardant Ratings Explained
“FR4” is a material designation, not a complete product approval. Verify the selected laminate, applicable material specification, flame rating and industry quality requirements.
Material specification
The controlled stack-up identifies the exact laminate grade and applicable IPC-4101 classification or customer specification.
Flame rating
V-0 evidence must come from the selected supplier grade or UL file; it cannot be assumed from the word FR4.
Applicable certification scope
ISO 9001, ISO 14001, IATF 16949 and ISO 13485 support the applicable production route when their scope matches the order.
Order-specific documents
Request RoHS and REACH documentation that applies to the laminate, process and order being supplied.
Why Choose Us
as Your FR4 PCB Manufacturer
“FR4” is a material family, not a complete purchasing specification. The key sourcing risk is whether the approved laminate grade, Tg class and released stack-up remain connected to the actual production lot and the next repeat order.
Controlled FR4 Material from Approved Laminate to Repeat Production
The build record starts with the exact laminate requirement and carries it through material verification, engineering release and repeat-order control. Buyers approve a specific FR4 construction instead of relying on a generic material name.
Approved Material at RFQ
Laminate grade or Tg class, supplier datasheet, stack-up and required compliance documents are defined before quotation release.
Incoming Laminate Lot Verification
Material identity, lot information and applicable certificate records are checked against the released build requirement before production.
Released Stack-Up and Repeat-Order Traceability
The approved material, revision, process route and inspection record stay linked so repeat production follows the controlled data set.
FR4 PCB Case Studies:
From Engineering Risk to Production Result
The layout is ready. Publish each case only after the FR4 grade, Tg, layers, thickness, copper, finish, challenge, action and measured result are verified.
Project challenge
待补充：客户提供的布线、机械、热管理或交付问题。
Engineering action
待补充：LZJPCB 已验证的 DFM、叠层、材料或工艺决策。
Measured result
待补充：有证据支持的交期、检验、良率或生产结果。
Project challenge
待补充：已验证的良率、阻抗、材料或供应商转移风险。
Engineering action
待补充：已发布的叠层、测试条、工艺或验证方法。
Measured result
待补充：附证据来源的返单、测试或生产结果。
FR4 PCB vs Other Materials:
Choose the Substrate Before RFQ
FR4 is the practical default for most rigid PCB programs. Change material when RF, thermal or environmental performance becomes the dominant requirement.
FR1 vs FR4 vs FR5: Which Laminate Fits the Build?
Use the material family specified for the product. Do not substitute by price alone.
FR1
Cost-led simple electronics
- Paper-based laminate family
- Lower structural capability
- Use only when the product specification permits
FR4
Broad rigid-PCB platform
- Glass-reinforced epoxy structure
- Balanced rigidity and multilayer processing
- Use when standard rigid-PCB requirements are met
FR5
Higher thermal-class builds
- Glass-reinforced epoxy family
- Thermal-performance focus
- Use when a validated thermal requirement justifies it
FR4 vs Ceramic and Rogers PCB: When to Change Materials
The right comparison is application fit, not a universal “best” material.
FR4 PCB
Default rigid-PCB platform
General digital, analog, control and power electronics.
- Mature multilayer processing
- Broad supply and fast prototype route
- Strong cost / capability balance
Rogers / RF laminate
RF electrical performance
High-frequency circuits where dielectric and loss control drive the design.
- Controlled RF material properties
- Material-specific stack-up
- Specialized processing route
Ceramic PCB
Thermal / environment focus
High-temperature, insulation or heat-transfer requirements.
- Thermal and environmental stability
- Specialized substrate
- Application-driven metallization
Continue from FR4 PCB Fabrication to
Complete Assembly
LZJPCB can manufacture the bare FR4 PCB, source the BOM, assemble SMT and through-hole components, inspect solder joints and deliver tested PCBAs through one production route.
01005 capability
Fine passive placement
0.35 mm BGA
Fine-pitch package assembly
SMT + THT
Mixed-technology assembly
AOI + SPI + X-Ray
Assembly inspection route
PCB
BOM
Assembly
Test
Get an Engineering-Reviewed
FR4 PCB Quote
FR4 PCB price is calculated from board dimensions, layer count, laminate/Tg, thickness, copper, finish, quantity, tolerance and special processes. Upload the actual files for an accurate quotation.
What you receive
- ✓Manufacturability review
Risks and engineering questions - ✓Material and stack-up scope
Controlled quotation basis - ✓Production quotation
Price based on the real specification - ✓Confirmed lead time
Schedule after engineering review
What happens after submission
File review
Engineers review files and requirements.
Manufacturing confirmation
Material, stack-up and special processes are confirmed.
Quote and lead time
You receive the production price and schedule.
Upload Your FR4 PCB Files
待补充｜Connect this form to the approved LiveCanvas / WordPress form endpoint before publishing.
FR4 PCB FAQs for
Buyers and Engineers
Short answers to the material and sourcing questions that remain after capability review.