Rigid-Flex PCB Manufacturer
LZJPCB manufactures custom rigid-flex printed circuit boards with engineering-led stackup review, controlled rigid-to-flex transitions, documented quality gates and assembly support. Send your Gerber, stackup and bend requirements to receive a build-ready quotation with a fixed scope and lead-time.
- Since 2006
- 50+ Engineers
- Rigid-Flex DFM
- ±5% Impedance
Rigid-Flex PCB Manufacturing Capabilities
Use this capability gate to qualify the manufacturing baseline, then submit the rigid/flex stackup for a construction-specific DFM release.
| Qualification item | Published baseline | Rigid-flex release control |
|---|---|---|
| Layer capability | 1–40 layers custom PCB; rigid-flex-specific range: 待补充 | Rigid and flex layer allocation is frozen in the approved stackup. |
| Trace / space | 3 / 3 mil safe minimum | Flex-zone geometry receives copper balance and bend-axis review. |
| Mechanical drill | 0.10 mm minimum | Via placement is checked against transition and bend keep-out zones. |
| Board thickness | 0.20–17.5 mm PCB range; rigid / flex zone range: 待补充 | Rigid and flex thicknesses are documented separately before release. |
| Copper weight | Up to 12 oz PCB capability; rigid-flex copper range: 待补充 | Flex copper weight and grain direction are locked to the bend requirement. |
| Impedance | ±5% control | Coupon, stackup and test record follow the quoted impedance requirement. |
| Materials | FR-4, High-Tg, Rogers, PTFE and hybrid systems; exact rigid-flex grades: 待补充 | Polyimide, coverlay, adhesive and stiffener are defined in the build package. |
| Finish & tolerance | Rigid-flex finish and tolerance table: 待补充 | The quotation records the selected finish and project-specific tolerances. |
| Inspection | AOI, X-ray and 100% electrical test | Transition, coverlay alignment and interconnect controls are added to the route. |
Custom Rigid-Flex PCB Design & Construction
Each construction block answers one purchasing question: how the design is released, when a special structure is used, and which data must be fixed before fabrication.
Rigid-Flex PCB Design & DFM
Our role is manufacturing DFM: we convert your released layout into a controlled fabrication build without presenting LZJPCB as a circuit design house.
- Bend axis, bend direction and flex length checked against the mechanical drawing.
- Rigid-to-flex transition, copper balancing and trace routing reviewed for stress concentration.
- Via placement, coverlay openings, stiffeners and component keep-outs checked before quotation release.
- Stackup, controlled impedance and test requirements returned as one documented manufacturing scope.
HDI Rigid-Flex PCB
HDI rigid-flex combines dense interconnection in the rigid zones with an integrated flexible interconnect, reducing connector count while protecting the bend area from HDI stress features.
- Microvia structure and sequential build data are reviewed as part of the HDI stackup.
- Laser-via locations remain outside defined dynamic bend and transition keep-outs.
- Pad geometry, via fill, copper balance and registration targets are fixed before production.
- AOI, X-ray and electrical test records support the released inspection plan.
Semi Rigid-Flex PCB
A semi rigid-flex construction creates a locally thinned or controlled flexible zone within a rigid-board architecture. It suits static forming and compact installation where a full multilayer rigid-flex build is unnecessary.
- Use the structure for installation bends and defined static forming—not repeated dynamic motion.
- Thinned-zone depth, remaining dielectric and copper geometry are stated on the fabrication drawing.
- The transition radius and routing direction are controlled to prevent a sharp stress edge.
- Cross-section evidence verifies the released local construction.
Rigid-Flex Layer Count & Construction
For 1–12-layer rigid flexible PCB search briefs, the useful answer is a released construction—not a layer-count label. Our engineering gate records the exact rigid layers, flex layers, material thicknesses and transition build.
- Rigid and flex layer counts are separated in the stackup instead of reported as one ambiguous total.
- Bookbinder, air-gap and bonded constructions are identified by the drawing package.
- Stiffener location, exposed flex length and bend direction are dimensioned.
- Production starts only from the stackup named in the quotation and order release.
Polyimide & Flexible Circuit Materials
Polyimide forms the flexible dielectric; rolled-annealed or specified copper carries the circuit; coverlay protects flex conductors; adhesive and stiffener selections control bonding and local support.
- Material manufacturer, dielectric thickness and copper weight are recorded in the approved stackup.
- Coverlay opening and adhesive flow controls protect pads and flex edges.
- FR-4 or other qualified rigid material is matched to thermal, electrical and assembly requirements.
- Material substitutions require a documented approval before production release.
Flex Thickness, Copper Thickness & Via Options
Flex thickness and copper thickness set bend stiffness; via strategy controls interconnect density and reliability. The final combination is stated numerically in the quotation package.
- Finished flex thickness is measured across the defined flex construction, not inferred from total board thickness.
- Copper weight, flex layers and grain direction are tied to the bend requirement.
- Through, blind, buried and microvia options are placed outside the active bend region.
- Annular ring, capture pad, via fill and electrical test requirements follow the released design.
Rigid-Flex PCB Applications
Rigid-flex adds the most value when space, connector reduction, controlled folding or assembly repeatability is a measurable system requirement.
Controlled interconnects support compact devices that require traceable materials and documented inspection.
Rigid-flex can replace cable assemblies between sensors, control boards and interface modules in constrained enclosures.
Defined bends and controlled transitions support space-constrained modules and sensor assemblies.
Integrated flex paths route controlled signals through constrained mechanical assemblies.
Rigid-Flex PCB Quality Control & Reliability
The inspection route focuses on the failure points unique to rigid-flex: transition integrity, coverlay registration, lamination, via interconnect, bend-zone copper and electrical continuity.
Material identity, thickness and lot records match the released bill of materials.
AOI and registration checks protect fine conductors, openings and transition geometry.
Construction evidence verifies dielectric, copper, interconnect and rigid-flex transition quality.
X-ray and section controls examine buried structures, filled vias and plated interconnects.
Every board receives electrical testing; specified controlled-impedance builds receive coupon evidence.
Rigid outline, flex outline, stiffeners, finish and marking are checked against the approved data.
Why Choose Us as Your Rigid-Flex PCB Manufacturer
One engineering release links the bend drawing, rigid-to-flex transition and approved stackup to production and final verification.
The highest project risk is not a generic layer count. It is whether mechanical bend intent survives the handoff into materials, lamination, transition geometry and inspection. LZJPCB keeps those decisions in one released manufacturing package.
Engineering aligns the bend direction, radius, flex length, transition, coverlay, stiffener and rigid/flex layer allocation before release.
The approved package controls material identity, imaging, lamination, drilling and transition-zone keep-outs instead of relying on shop-floor interpretation.
AOI, X-ray or microsection where specified, dimensional checks and 100% electrical test confirm the interconnect and transition requirements before shipment.
Rigid-Flex PCB Case Studies
A credible case study must expose the construction, design risk, production control and verified result. These proof blocks are prepared for customer-approved project evidence.
Use this record for a customer-approved design that replaces board-to-board cables inside a constrained enclosure.
Publish only after the customer authorizes the project data.
Use this record for a released HDI build that combines fine-pitch rigid zones with a defined flexible interconnect.
Publish only after the customer authorizes the project data.
Use this record for a project that moves from rigid-flex fabrication through component placement and functional test.
Publish only after the customer authorizes the project data.
Rigid-Flex PCB Cost
Your rigid-flex PCB price is calculated from the released construction and order quantity. The quotation names every included cost driver instead of hiding them behind a generic board price.
More flex layers, complex transitions and sequential builds increase material and process steps.
Specified dielectric, copper, adhesive, stiffener and controlled material brands define the material set.
Microvia cycles, via fill, blind/buried structures and registration targets add process control.
Irregular flex tails, routing gaps and panel layout determine how much material each finished unit consumes.
Dynamic or tight-radius requirements drive copper selection, thickness, construction and validation.
Finish type, selective finish, edge contacts and thickness requirements are priced from the drawing.
Impedance coupons, cross-sections, X-ray, fixtures and product test are listed in the quality plan.
Prototype quantity, production panelization and scheduled releases determine tooling and unit economics.
Rigid-Flex PCB Cost Comparison
Compare construction complexity first. Two boards with the same outline and layer count do not carry the same cost when the flex layers, via structure and bend requirement differ.
Defined flex layer, conventional through vias and a simple transition create the shortest process route.
Additional flex layers, controlled impedance and more complex bonding add materials, registration and inspection.
Sequential microvias, fine geometry or repeated-flex requirements create the highest engineering and control load.
Rigid-Flex vs Flex vs Rigid PCB Cost
Rigid-flex has a higher bare-board cost than a rigid PCB or flex PCB alone, while removing connectors, cables, assembly steps and enclosure space. Compare system cost—not only PCB unit price.
Best for flat, mechanically supported electronics. Board complexity is lowest, while external cables or connectors handle separation.
Best for lightweight routing, folding and cable replacement without integrated rigid component zones.
Best for compact 3D assemblies. Higher board complexity can be offset by fewer connectors, cables and manual interconnect steps.
Send the released data pack and annual quantity. Your quotation returns the exact construction, tooling, test scope, unit price and fixed production lead-time.
Request Costed BuildRigid-Flex PCB Prototype & Quick Turn
A quick-turn rigid-flex prototype is fast because the input and release gates are explicit. The quotation fixes the approved build, quantity and lead-time before production begins.
Four-gate prototype route
Each gate creates a concrete output your engineering and purchasing teams can approve.
Gerber, drill, stackup, mechanical drawing, bend data, quantity and acceptance criteria received.
Transition, bend zone, materials, coverlay, stiffeners, vias and impedance reviewed.
Quotation names the construction, test plan, prototype quantity and fixed lead-time.
Fabrication, inspection, 100% electrical test and shipment records follow the released order.
Rigid-Flex PCB Assembly
Move from rigid-flex bare board to assembled product through one controlled data handoff, including flex handling, component placement, connector installation and testing.
Fine-pitch devices, passive components and rigid-zone placement follow the released centroid and assembly drawing.
Through-hole parts, board connectors and mechanical hardware are installed with defined support for flex areas.
X-ray verifies hidden joints and supports the inspection route for dense rigid-zone packages.
Customer-supplied firmware and test procedures become controlled work instructions for the order.
Handling and support protect bend zones, exposed flex tails and rigid-to-flex transitions during assembly.
Bare-board lot, component lot and inspection records remain linked through final shipment.
Get a Rigid-Flex PCB Quote
Send one complete data package. We will quote the exact construction, quantity, inspection scope and lead-time stated in the returned offer.
Include these eight inputs
A complete RFQ removes the qualification loop and gives engineering enough data to release a costed build.
- Gerber / ODB++ and NC drill files
- Rigid-flex stackup with rigid and flex layer count
- Mechanical outline and rigid-to-flex transition drawing
- Bend direction, bend radius and dynamic/static requirement
- Material, finished thickness and copper requirements
- Controlled impedance and acceptance criteria
- Prototype quantity and annual production quantity
- BOM, centroid and test data for assembly projects
Manufacturing scope, released construction, tooling, testing, quantity price breaks and fixed quoted lead-time.
Frequently Asked Questions About Rigid-Flex PCB
Short answers for product selection, supplier qualification and system-cost decisions.
What Is a Rigid-Flex PCB?
A rigid-flex PCB integrates rigid component-support areas and flexible circuit areas into one laminated printed circuit structure. The flex zones fold or route between rigid sections, eliminating separate cables and board-to-board connectors. Its fabrication data must define the rigid stack, flex stack, transition zones, bend requirement, coverlay and stiffeners.
Rigid-Flex PCB vs Rigid PCB vs Flex PCB
A rigid PCB supports components on a flat board. A flex PCB provides a bendable interconnect. Rigid-flex integrates both functions into one laminated structure.
Rigid component support for flat, non-flexing assemblies. Cables or connectors bridge separated boards.
Thin flexible interconnect for folding, routing and cable replacement without rigid mounting zones.
Rigid mounting zones and integrated flex interconnects in one construction for controlled 3D packaging.
Choose rigid-flex when component support and controlled folding must coexist without separate connectors.
When Should You Use Rigid-Flex PCB Instead of Separate Rigid and Flex Boards?
Use rigid-flex when connector reduction, enclosure space, lower assembly count, controlled folding or interconnect repeatability has measurable system value. Keep separate rigid and flex boards when modular replacement, independent sourcing or a simple low-volume cable interface is the stronger requirement. The final selection should compare complete assembly cost, mechanical risk and service strategy—not bare-board price alone.