SMT AND THROUGH-HOLE ASSEMBLY SERVICES
Mixed Technology PCB Assembly
LZJPCB is a PCB and PCBA manufacturer providing mixed technology assembly for boards combining SMT and through-hole components. From prototypes to volume production, our engineers coordinate sourcing, soldering and quality testing to reduce your assembly risks.
Mixed Technology PCB Assembly Capabilities
Combine SMT components with through-hole connectors and power components on one PCB, with manufacturing and inspection requirements reviewed before assembly.
SMT and Through-Hole Assembly on One PCB
Your PCB assembly follows a coordinated process to protect component placement, soldering quality and electrical performance.
- Fine-pitch SMT assembly
- BGA component placement
- Through-hole component insertion
- Mixed SMT and THT assembly
- Wave and selective soldering
SMT and Through-Hole PCB Assembly Process
LZJPCB coordinates SMT placement, through-hole soldering and inspection to keep your mixed assembly consistent from prototype to production.
Assembly Engineering Review
Your BOM, PCB layout and component requirements are reviewed to define the assembly sequence.
SMT Placement and Reflow
Surface-mount components are placed and soldered using controlled SMT production processes.
Through-Hole Soldering and Inspection
Through-hole components are assembled using wave, selective or manual soldering, followed by inspection.
Mixed Technology PCB Assembly Quality & Testing
Different component types require different inspection methods. LZJPCB combines assembly inspection and electrical testing to help you identify defects before delivery.
Quality Control for Mixed PCB Assembly
- 3D SPI solder paste inspection
- AOI component inspection
- X-ray inspection for hidden joints
- ICT electrical testing
- Functional testing to your requirements
Get a Mixed Technology
PCB Assembly Quote
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