Custom Alumina PCB
Manufacturing
Al₂O₃ ceramic substrates with full in-house circuit process -- DBC, DPC, AMB, Thick Film, Thin Film, LTCC and HTCC available
Prototype to production. Engineering review included. Tell us your thermal, electrical and mechanical requirements -- we match the grade and process.
Is Alumina the Right Ceramic
for Your Design?
Alumina (Al₂O₃) suits most power, LED and industrial applications. Confirm your requirements before specifying grade and process.
Alumina Fit Checklist
- Thermal conductivity requirement: 20-35 W/m·K is sufficient
- Operating temperature: up to 300°C
- Electrical isolation: high dielectric strength required
- Mechanical: moderate vibration/shock environment
- Cost: budget-conscious vs AlN
- CTE: ~7 ppm/°C compatible with your device and substrate stack
- Surface: standard surface finish acceptable
- Volume: prototype or production quantities
If most items above match your design conditions, Alumina is likely the right path. If your thermal requirement exceeds 80 W/m·K or CTE matching is critical, review AlN.
Need Higher Thermal Performance?
AlN delivers 140-170 W/m·K. Better for high-power density and tight CTE matching.
→ Explore Aluminum Nitride PCBLower Cost, Lower Complexity?
Metal Core PCB (MCPCB) offers simpler processing at lower cost for standard LED and power applications.
→ Explore Metal Core PCBStandard PCB Application?
If temperature and isolation requirements are within FR4 limits, standard PCB may be sufficient.
→ Explore Standard FR4 PCB
Define the Alumina Grade
and Circuit Process
Alumina PCB starts with material grade selection, then circuit formation process. Both decisions affect thermal performance, surface quality, line resolution and cost.
Alumina Grade Comparison
| Parameter | Standard Alumina | High-Purity Alumina |
|---|---|---|
| Al₂O₃ Purity | 96% | 99%+ |
| Thermal Conductivity | ~20 W/m·K | ~30-35 W/m·K |
| Surface Roughness | Standard | Finer |
| Dielectric Strength | High | Very High |
| Cost | Lower | Higher |
| Typical Use | Industrial, LED, Power | Precision, Thin Film, RF |
Grade selection depends on your thermal budget, surface finish requirement and circuit resolution. We will advise based on your design inputs.
Circuit Process Routes for Alumina Substrates
Direct Bonded Copper
Copper foil directly bonded to Alumina substrate at high temperature.
Direct Plated Copper
Copper deposited via sputtering and plating on Alumina for fine-pitch circuits.
Active Metal Brazing
Active metal brazing for high-adhesion copper bonding on Alumina substrates.
Thick Film
Conductive paste screen-printed and fired onto Alumina substrates.
Thin Film
Vacuum-deposited metal on high-purity Alumina for precision circuits.
Low Temperature Co-fired Ceramic
Alumina-based multilayer co-fired at low temperature for 3D integration.
High Temperature Co-fired Ceramic
High-temp co-fired Alumina multilayer for extreme reliability applications.
Cross-section: Alumina substrate / Copper layer / Metallization / Device attach / Heatsink interface
Design the Copper, Metallization and Interfaces
Copper and Metallization
Define copper thickness, line width/space, pad geometry and surface finish (Ni/Au, Ag). We review against process-specific design rules for each route.
Holes, Slots and Edge Definition
Laser cutting, dicing or punch options depending on geometry. Edge quality and corner radius reviewed at DFM stage.
Device and Assembly Interfaces
Specify die attach, wire bonding, solder reflow or press-fit requirements. We define what the substrate supports and where assembly responsibility boundary lies.
Thermal and Mechanical Interface
Define heatsink or housing contact surface. Flatness, CTE stack and mounting method reviewed to avoid cracking under thermal cycling.
Note: Alumina is brittle. Mounting, clamping and CTE mismatch conditions must be reviewed before finalising the build.
Resolve Alumina Manufacturing
and File Risks
Alumina requires specific handling at every stage -- geometry, edge definition, file format and version control all affect yield and delivery.
Manufacturing Risk Register
Brittleness and Handling
Ceramic cracks under point load. Mounting holes, edge chamfers and panel layout reviewed before production.
Flatness and Bow
Substrate flatness affects bonding and device attach yield. Thickness and panel size reviewed against tolerance.
Edge and Corner Quality
Laser cut vs diced edge quality differs. Specify edge type and corner radius at design stage.
Copper Adhesion
Each process route has different adhesion mechanism. DFM checks peel strength conditions for your application.
Thermal Cycling Compatibility
CTE mismatch between Alumina, copper and device can cause delamination. Stack reviewed against your cycle range.
File Requirements
Accepted File Formats
Gerber / DXF / DWG / PDF with full layer stack description
Required Inputs
Board outline with datum, layer stackup, drill/slot table, copper weight per layer, surface finish specification
Version Control
All files must carry revision number. Changes after EQ approval require new EQ cycle.
Packaging and Handling Notes
Specify fragile marking, tray/foam requirements and ESD protection if applicable.
Verify Alumina Material
and Circuit Quality
Each Alumina PCB order goes through defined inspection and test stages. Verification scope is agreed before production starts.
| Verification Item | Method | Frequency | Acceptance Standard | Record |
|---|---|---|---|---|
| Material CoC | Supplier certificate review | Every batch | Grade and purity confirmed | CoC on file |
| Dimensional Inspection | CMM / optical measurement | 100% or sample | Per drawing tolerance | Inspection report |
| Surface and Visual | Optical / visual check | 100% | No crack, chip, void | Visual record |
| Copper Adhesion | Cross-section / peel test | Sample basis | Per process spec | Test report |
| Electrical Continuity | Flying probe / bed of nails | 100% (by requirement) | Per net list | Test report |
| Dielectric / Isolation | Hi-pot test | Per order requirement | Per design voltage spec | Test record |
| Reliability (if required) | Thermal cycling / damp heat | Project basis | Per agreed standard | Reliability report |
Verification scope, sampling plan and acceptance criteria are confirmed in the EQ or order acknowledgement. Non-conformance handling procedure available on request.
See Evidence of Repeatable
Alumina PCB Production
We document the full chain from incoming substrate to finished board. Evidence is available for NPI qualification and repeat production review.
Material Traceability
Alumina substrate sourced and logged by grade, purity and batch number. CoC available for every order.
In-Process Records
Key process parameters recorded at each stage -- bonding, firing, plating or deposition depending on route.
Inspection and Test Reports
Dimensional, visual, electrical and isolation reports issued with each batch. Cross-section available for sample review.
Repeat Order Consistency
Repeat orders reference approved first article. Change control applied to material, process and file revisions.
What Determines Alumina PCB
Cost and Lead Time?
Alumina PCB cost and lead time are project-specific. The key drivers below explain why two similar-looking boards can differ significantly in price and schedule.
We do not publish fixed prices or standard lead times. All quotes are based on your confirmed material grade, process route, geometry and quantity.
Typically 7-10 business days, subject to material procurement and process route.
Typically 3-4 weeks, subject to material procurement and process route.
Cost & Lead Time Driver Matrix
| Driver | Cost Impact | Lead Time Impact |
|---|---|---|
| Alumina grade / purity | Higher purity = higher cost | May affect substrate procurement |
| Substrate thickness | Thicker = higher material cost | Standard thickness faster |
| Board size / utilisation | Larger or irregular = lower utilisation | Affects panel planning |
| Circuit process route | Thin Film / AMB higher than DPC | Thin Film / LTCC / HTCC longest |
| Line width / tolerance | Tighter = higher NRE and process cost | Adds DFM and EQ time |
| Surface finish | Ni/Au standard; others on request | Depends on process availability |
| Quantity | Lower unit cost at volume; NRE amortised | Production run longer than prototype |
| Test requirements | Hi-pot, reliability test add cost | Adds schedule days |
| Expedite | Available subject to capacity | Discuss at RFQ stage |
Alumina PCB Questions Before
You Request a Quote
What is the difference between Alumina PCB and Aluminum PCB?
These are completely different products. Alumina PCB uses aluminum oxide (Al₂O₃) ceramic as the substrate -- a non-metallic material with high electrical isolation and thermal conductivity of 20-35 W/m·K. Aluminum PCB (MCPCB) uses a metal aluminum base with a dielectric layer, typically achieving 1-3 W/m·K. They are not interchangeable. If you are searching for metal-base boards, see our Metal Core PCB page.
→ Metal Core PCBHow do I choose between Alumina and Aluminum Nitride (AlN)?
If your thermal conductivity requirement is below 40 W/m·K, Alumina is usually sufficient and more cost-effective. If you need 80 W/m·K or above, or require tighter CTE matching with silicon or GaN devices, AlN is the right choice. We can review your thermal budget and advise.
→ Aluminum Nitride PCBWhich circuit process routes are available for Alumina substrates?
We support all seven process routes on Alumina substrates: DBC, DPC, AMB, Thick Film, Thin Film, LTCC and HTCC. The right route depends on your copper thickness, line resolution, operating temperature and reliability requirements. We will recommend based on your design inputs.
→ Ceramic PCB -- Process RoutesDo you provide device attach, wire bonding or PCB assembly on Alumina PCB?
Our scope covers the ceramic substrate and circuit layer. Device attach, wire bonding and board-level assembly are outside our standard delivery. If your project requires a turnkey path, contact us to discuss referral or partner options.
→ PCB Assembly
Request an Alumina PCB Quote
or Process Review
Two ways to start -- depending on how complete your design inputs are.
Your Design Is Defined
You have material grade, process route, geometry, quantity and file ready.
Submit with your quote request:
- Alumina grade / purity
- Circuit process route
- Board dimensions and thickness
- Copper weight and line spec
- Surface finish
- Quantity and target date
- Design files (Gerber / DXF)
Your Requirements Are Defined, Design Is Not
You have thermal, electrical or mechanical targets but have not locked material or process yet.
Share with your review request:
- Application and operating conditions
- Thermal dissipation target
- Voltage isolation requirement
- Any known mechanical constraints
- Quantity estimate and timeline