Our Manufacturing Capabilities
From raw materials to finished PCBAs -- explore the full depth of LZJPCB's technical capabilities, precision processes, and material expertise that power electronics worldwide.
Three Pillars of LZJPCB Excellence
Select a capability area to explore detailed specifications, processes, and technical parameters.
Assembly Capabilities
Full turnkey PCBA services -- SMT, DIP, BGA soldering, 3D SPI, AOI, X-Ray inspection, and functional testing. Submit Gerber + BOM, receive finished, tested PCBAs.
- 20+ SMT Lines · 200M placements/month
- SMT · DIP · BGA · Through-Hole
- 100% AOI + X-Ray for BGA/Buried Vias
- IPC Class 2 / Class 3 Standard
Fabrication Capabilities
Precision bare PCB manufacturing from 1 to 40 layers. FR4, HDI, Flex, Rigid-Flex, High-Frequency, Heavy Copper, Aluminum, and Ceramic -- all under one roof with rigorous process control.
- Up to 40 Layers (Prototype) / 32 (Volume)
- Min. Line/Space: 3mil/3mil (Mech.) · 2.5mil (Laser)
- Blind/Buried Vias · Back Drilling · Gold Fingers
- Impedance Control ±5% · 50,000 sqm/month
Materials & Surface Finishes
Comprehensive substrate material selection and 9+ surface finish options. From standard FR4 to Rogers high-frequency laminates, ENIG to ENEPIG -- matched precisely to your application.
- FR4 · Rogers · Ceramic · Aluminum · Polyimide
- HASL · ENIG · ENEPIG · Immersion Silver/Tin
- Copper 0.5oz - 12oz · Max Thickness 17.5mm
- 8+ Solder Mask Colors Available
Technical Depth at Every Layer
32L Volume Production
Per Month · 20+ SMT Lines
HASL · ENIG · ENEPIG · More
Free DFM Review Included
Capabilities Trusted Across Sectors
Quality Certifications & Standards
Have a Project in Mind?
Upload your Gerber files and get an instant quote. Our engineers are ready to review your design and help you move from concept to production.
info@lzjpcb.com · 98%+ Yield Rate · 99% On-time Delivery · Free DFM Review
