Rigid PCB
Manufacturing Services
Custom rigid PCB fabrication for single-sided, double-sided and multilayer designs -- from prototype evaluation to repeat production. Submit your project files or request a capability review to get started.
Is a Rigid PCB the Right Structure for Your Design?
Before comparing layer counts or materials, confirm which board structure matches your project's mechanical and interconnect requirements. Choosing the wrong structure makes later specifications less relevant.
Rigid PCB
Consider this structure when:
- Board will be permanently mounted in a fixed plane
- Mechanical support is required from the board itself
- No flex, bend or dynamic movement is needed
- Single-sided, double-sided or multilayer interconnect
Not the right fit if:
- Installation requires a one-time flex bend
- Board connects moving parts during operation
You are in the right place.
Flex PCB
Consider this structure when:
- Board must bend or flex during installation
- Application involves dynamic, repeated movement
- Tight routing space requires a conformable shape
Rigid-Flex PCB
Consider this structure when:
- Design includes rigid mounting zones connected by integrated flexible sections
- Eliminates separate connectors between rigid boards
- Combines structural support with flexible routing
Not sure which structure fits? Compare Board Structures / Ask Which Structure Fits →
Choose the Rigid PCB Construction Your Design Requires
Once you have confirmed a rigid structure, the layer count and interconnect type determine whether your design stays within standard fabrication, moves to a Multilayer or HDI scope, or needs an engineering review before a quote can be issued.
Single-Sided
1 conductive layer; simplest rigid construction
Double-Sided
2 conductive layers; through-hole vias
Initial Fabrication Scope -- Rigid PCB
| Requirement | Standard Scope | Engineering Review Required |
|---|---|---|
| Layer Count | To be confirmed per approved matrix | Beyond confirmed standard layers |
| Min. Trace / Space | To be confirmed per approved matrix | Below standard; specify in project files |
| Via Type | Through-hole; blind/buried per project | Sequential lamination; any non-standard via |
| Board Thickness | Standard range -- confirm on inquiry | Non-standard thickness or tight tolerance |
| Board Dimensions | Standard panel range -- confirm on inquiry | Oversized or non-standard outline |
| Copper Weight | Standard outer/inner -- confirm on inquiry | Heavy copper; specify requirement |
| Controlled Impedance | Available -- specify target and tolerance | Multi-layer referenced impedance; HDI |
Scope values are confirmed per the approved capability matrix and project conditions. Submit your Gerber, stackup and fab drawing to receive a specific evaluation. Full capability detail → /capabilities/
Match Materials and Finishes to Electrical, Thermal and Assembly Needs
Material and surface finish selection should follow your actual performance, environment and assembly requirements -- not familiarity with a product name. Provide the conditions below to identify candidates or request a recommendation.
Project Conditions That Drive Material and Finish Selection
Electrical / Frequency
Provide: Operating frequency, signal loss budget, Dk/Df requirement, impedance target
Options: Standard FR4 (mid-frequency); low-loss substrates for RF/high-speed -- see High-Frequency PCB page
Thermal / Current
Provide: Power dissipation, max operating temp, copper weight requirement
Options: High-Tg FR4; heavy copper -- see Heavy Copper; Metal-core: see Metal-Core PCB page
Mechanical / Thickness
Provide: Board thickness, tolerance, layer stackup, panel dimensions and routing clearance
Options: Confirm per approved stackup and matrix
Environmental / Compliance
Provide: Operating temperature range, humidity, vibration, RoHS or halogen-free requirement
Options: Standard FR4 variants; halogen-free grades -- confirm availability per material supply
Assembly / Storage
Provide: Solder process (SAC / lead), assembly cycles, shelf life requirement, BGA or fine-pitch
Options: HASL; ENIG; OSP; IAg; ISn -- confirm per project
FR4 is a material category, not a synonym for all rigid PCBs. Rogers, high-frequency, metal-core and heavy-copper requirements have dedicated pages. Availability of specific grades subject to confirmed supply.
FR4 Rigid PCB cross-section -- copper layers and dielectric visible
Surface finish comparison -- ENIG and OSP. Actual combination confirmed per project conditions and approved supply.
Resolve Rigid PCB Build Risks Before Fabrication
After an initial construction and material candidate has been identified, a DFM and engineering review checks your files for issues that would affect fabrication -- before materials are committed or production begins. Conflicts are raised as engineering questions; you retain approval on any change.
Stackup / Layer Conflict
Impedance vs. Trace Geometry
Via, Drill and Copper-to-Edge
File Version and Specification Mismatch
Engineering Question Example -- Controlled Impedance
Project type
Rigid PCB, multilayer, controlled impedance
File reviewed
Gerber + stackup note
Issue found
Target impedance 50Ω; calculated trace width does not match supplied Dk value.
EQ raised
Proposed revised trace width provided for customer review.
Customer action
Confirmed revised geometry. Updated file set approved before fabrication.
Identifiers removed. Representative of review process.
Engineering review identifies issues in submitted files; it does not replace design responsibility or guarantee all conflicts will be found. Customer approval is required before any change is applied.
Understand How Your Rigid PCBs Will Be Verified
Each rigid PCB order includes specific checks and tests tied to the requirements confirmed in your project. The table below maps fabrication risks to the verification method, applicable condition and output record. What applies to your order depends on the build, standard and requirements specified.
| Fabrication Risk | Inspection / Test Method | Applicable Condition | Output Record | Limitation |
|---|---|---|---|---|
| Open / short circuit | Electrical continuity test (flying probe or fixture) | All layers; confirm per order scope | Test report | Does not verify material, geometry or final product function |
| Trace width / spacing | AOI -- automated optical inspection | Per fab drawing and Gerber | AOI report or exception record | Sample-based where applicable; confirm inspection scope on order |
| Hole size / location | Mechanical measurement or AOI | Per drill file and fab drawing | Dimension check record | Sampling rate confirmed per order |
| Plating thickness | Cross-section or X-ray measurement | Specified plating requirement | Cross-section image and measurement record | Destructive method -- confirm sampling plan |
| Controlled impedance | TDR impedance measurement on coupons | When impedance specified in project | Impedance test report | Coupon-based; confirm coupon design in stackup |
| Surface finish | Visual + thickness measurement | Per specified finish type | Finish inspection record | Confirm applicable measurement method per finish |
| Board dimensions / outline | Mechanical or optical measurement | Per fab drawing tolerances | Dimension record | Confirm tolerance in submitted files |
| Cosmetic / appearance | Visual inspection per applicable standard | Per agreed workmanship standard | Visual inspection record | Standard version and grade confirmed per order |
Electrical test does not replace material, geometric, thermal or final product function verification. Any IPC standard reference is tied to a specific standard version, grade, product type and order requirement -- confirm on inquiry. Full quality system detail → /quality/ · Certificates → /certifications/
Verification Record Sample
(Identifiers removed)
Order type
Rigid, multilayer
Test applied
Electrical continuity + impedance coupon
Standard ref
[per order]
Result
Within specified tolerance
Record
Test report retained with order file
Representative sample only. Actual report provided with your order as agreed.
See the Manufacturing Evidence Behind Your Rigid PCB
Three sets of evidence help evaluate whether the manufacturer's claims are grounded: who is responsible and where work is performed; which process steps apply to a rigid PCB order; and how a prototype build is maintained through repeat production.
Manufacturing Entity and Process Role
What this shows:
- Legal entity responsible for the Rigid PCB order
- Which process steps are performed and where
- How subcontracting, if any, is disclosed
What it does not show:
Factory size, headcount and equipment count alone do not demonstrate stable delivery capability.
[Evidence placeholder: RIG-EV01 / RIG-EV07] Entity documents, facility and process assignment records -- pending LZJPCB internal approval.
Board Samples and Fabrication Records
What this shows:
- Actual Rigid PCB bare boards and cross-sections that correspond to stated construction claims
- Inspection and measurement records matched to the specific order
What it does not show:
A single sample or prototype does not demonstrate volume production range or repeat consistency.
[Evidence placeholder: RIG-EV02 / RIG-EV04 / RIG-EV06] Real board photographs with authorization, cross-section images and matched measurement records -- pending.
Prototype to Repeat Production Continuity
What this shows:
- Approved file version retained from prototype
- Material and stackup confirmed for repeat orders
- First article and batch records available
What it does not show:
Version continuity does not guarantee identical lead time, material availability or yield across all subsequent orders without re-confirmation.
[Evidence placeholder: RIG-EV08 / RIG-EV14] Version records, material records and batch continuity documentation -- pending approval.
Prototype File Set
(customer-approved)
First Article
(record kept)
Approved Version
(material confirmed)
Repeat Batch
(same file set)
Each step: file set version matched to board, material and inspection record.
What Determines Rigid PCB Cost and Lead Time?
Cost and lead time for a rigid PCB order are determined by the specific build, material, quantity and timeline submitted with your project. The variables below explain what changes a quote or delivery date -- not a price or unconditional day count.
Cost Variables -- What Changes the Quote
Board Size and Panelization
Larger or non-standard panel affects yield and material consumption.
Layer Count and Stackup
More layers, buried/blind vias or sequential lamination increases cost.
Material and Copper Weight
High-Tg, low-loss or heavy-copper grades affect material cost and availability.
Fine Features and Special Processes
Tight trace/space, controlled impedance, special via types add process steps.
Surface Finish and Test Scope
ENIG, immersion silver, impedance coupon test and additional inspection affect cost.
Quantity and Order Stage
Prototype, low-volume and repeat production have different unit economics.
Expedite and Delivery Requirements
Rush turnaround and specific delivery window requirements affect scheduling.
Rigid PCB cost is confirmed per submitted project details. No published price list. Prototype and repeat production are evaluated separately -- see /pcb-prototype/ for prototype and quick-turn scope.
How Lead Time Is Calculated
File Review and EQ
Gerber, drill, fab drawing and stackup confirmed or EQ issued.
Duration: depends on file completeness and EQ response.
Material and Engineering Confirmation
Material availability, special grade procurement or stackup approval confirmed.
Duration: per supply status.
Fabrication and Inspection
Manufacturing and agreed inspection completed.
Duration: per approved lead time policy and build.
Shipment
Packaging, labeling and outbound logistics arranged.
End point: ex-works or agreed delivery term.
Lead time confirmed per approved policy, build and order conditions. No unconditional day count published.
Rigid PCB Questions Before You Request a Quote
These questions address boundary cases that may remain after reviewing the sections above. Each links to the relevant section or the correct page owner.
How do I decide between a rigid, flex and rigid-flex PCB?
The choice depends on your mechanical and interconnect requirements -- not on application industry or component count.
- Rigid: board mounts in a fixed plane; no bending required; mechanical support comes from the board itself.
- Flex: board must bend or flex during installation or in operation; dynamic or static flex routing.
- Rigid-Flex: design includes rigid mounting zones connected by integrated flexible sections in a single construction.
Formal answer pending: RIG-MI13 -- LZJPCB boundary conditions and application cases to be approved.
Can a rigid PCB also be multilayer or HDI?
Yes. Rigid describes the board structure -- it stays in a fixed plane and provides mechanical support. Layer count and interconnect type are separate dimensions:
- A rigid PCB can be single-sided, double-sided or multilayer.
- HDI (microvias, sequential lamination, high interconnect density) is an additional requirement that can apply to a rigid multilayer design.
Formal answer pending: RIG-MI03 -- approved capability matrix and layer/interconnect conditions required.
What files are needed to evaluate a custom rigid PCB?
A complete file set for rigid PCB fabrication evaluation typically includes:
- Gerber files (RS-274X) or ODB++ with all layers
- Drill file (Excellon or equivalent)
- Fabrication drawing (board outline, tolerances, hole chart, finish and stackup note)
- Stackup specification (layer order, material, dielectric thickness, copper weight)
For controlled impedance: impedance targets with layer and trace reference. For special via or surface finish requirements: note in fab drawing or separate specification.
Formal answer pending: RIG-MI06 -- accepted file formats, version and attachment policy to be confirmed.
Can my rigid PCB move from prototype to assembly and repeat production?
Prototype and repeat production are handled as separate order stages. Moving from prototype to repeat production requires:
- Approved file set and stackup version retained from prototype build
- Material and finish confirmed for repeat supply
- Any first-article or engineering review results recorded before repeat order is placed
Formal answer pending: RIG-MI09 -- version continuity, material confirmation and batch record policy required.
Still have a Rigid PCB question?
Contact UsRequest a Rigid PCB Quote or Capability Review
Use the checklist below to prepare your project input. If all required files and specifications are ready, request a quote. If your build, material, structure or files are not yet defined, a capability review identifies what needs to be resolved before fabrication can begin.
RFQ Preparation Checklist
Required Files
- Gerber files (RS-274X) or ODB++
- Drill file (Excellon or equivalent)
- Fabrication drawing (outline, tolerances, finish)
- Stackup specification
Specifications to Include
- Layer count and board thickness
- Surface finish type
- Controlled impedance targets (if applicable)
- Special via types (blind/buried)
- Quantity and target delivery date
- IPC class requirement (Class 2 / Class 3)
Files Not Yet Complete?
Request a capability review. Our engineering team will identify what needs to be resolved before fabrication can begin.
Submit Your Rigid PCB Project
Fill in your details and upload your project files. We'll review and respond within 1 business day.