PCB Assembly · SMT · DIP · BGA · Full Inspection

PCB Assembly
Capabilities

Check whether your PCB type, component packages, soldering process, inspection and testing requirements fit our assembly capabilities before production.

LZJPCB PCB Assembly production line -- SMT and PCBA manufacturing

Rigid PCB Assembly Capabilities

Assembly Item	LZJPCB Capabilities	Engineering Notes
Assembly Technologies	SMT, Through-Hole, Mixed Technology	Supports SMD-only, THT-only and mixed-component PCB assemblies
Assembly Sides	Single-Sided, Double-Sided	Supports components assembled on one or both sides of the PCB
Minimum Component Size	01005	Suitable for compact and high-density PCB designs
Fine-Pitch Packages	BGA, QFN, QFP, LGA, CSP, DFN	Package capability should be checked against PCB pad design and component specification
Minimum BGA Pitch	[Factory Confirm]	Fine-pitch BGA projects require engineering review before production
Placement Accuracy	[Factory Confirm]	Actual requirement depends on package pitch, pad design and component geometry
PCB Thickness	[Factory Confirm]	Supports standard and applicable non-standard rigid PCB thicknesses
Maximum PCB Size	[Factory Confirm]	Oversized or non-standard boards require engineering assessment
Solder Paste Printing	Supported	Solder paste deposition can be checked before component placement
SPI	3D SPI	Helps detect insufficient paste, excess paste and printing deviation before reflow
Reflow Soldering	Lead-Free / Leaded Available	Reflow profile is selected according to PCB construction and component requirements
Through-Hole Assembly	Supported	Suitable for connectors, transformers and mechanically loaded components
Wave Soldering	Supported	Available for applicable through-hole and mixed-technology assemblies
Selective Soldering	Supported	Suitable when localized through-hole joints require controlled soldering
AOI	Supported	Checks component presence, orientation, placement and visible solder defects
X-Ray Inspection	Supported	Used for BGA, QFN and other hidden solder joints
Electrical / Functional Testing	Supported	Test method can be defined according to your product requirements
BGA Rework	Supported	Controlled removal and replacement available for applicable packages
Conformal Coating	Supported	Available when environmental protection is required
Production Stages	Prototype, NPI, Low Volume, Volume Production	Supports projects from engineering validation to repeat production

Flex PCB Assembly Capabilities

Assembly Item	LZJPCB Capabilities	Engineering Notes
PCB Type	Flexible PCB / FPC	Supports applicable single-sided, double-sided and multilayer flex assemblies
Assembly Technologies	SMT, THT, Mixed Technology	Process route is selected according to flex construction and component layout
Assembly Sides	Single-Sided, Double-Sided	Board support and tooling are evaluated for each assembly side
Minimum Component Size	01005	Fine components require stable flex support during placement
Fine-Pitch Packages	BGA, QFN, QFP, LGA, CSP	Package layout and local flex rigidity should be reviewed before production
Minimum BGA Pitch	[Factory Confirm]	Fine-pitch packages require PCB and component engineering review
Flex Thickness	[Factory Confirm]	Actual assembly capability depends on total flex construction and stiffener design
Carrier / Fixture Support	Supported	Fixtures help keep flexible circuits flat during printing, placement and reflow
Stiffener PCB Assembly	Supported	Component locations and stiffener areas can be reviewed before assembly
Flex Area Protection	Engineering Controlled	Bend areas and unsupported flex sections should be protected during processing
Solder Paste Printing	Supported	Fixture support improves printing consistency on flexible substrates
SPI	3D SPI	Checks solder paste before component placement
SMT Placement	Supported	Placement setup is adjusted according to board support and component density
Reflow Soldering	Supported	Reflow profile is reviewed according to material construction and component requirements
AOI	Supported	Used for visible placement and soldering inspection
X-Ray Inspection	Supported	Available for BGA, QFN and hidden solder connections
Electrical / Functional Testing	Supported	Customer test procedures can be reviewed before production
Production Stages	Prototype, Low Volume, Volume Production	Supports flex assembly from validation through repeat orders

Rigid-Flex PCB Assembly Capabilities

Assembly Item	LZJPCB Capabilities	Engineering Notes
PCB Type	Rigid-Flex PCB	Supports PCB assemblies combining rigid component areas and flexible interconnect sections
Assembly Technologies	SMT, THT, Mixed Technology	Process sequence is planned according to component locations and rigid-flex construction
Assembly Sides	Single-Sided, Double-Sided	Applicable assembly sides depend on board construction and fixture access
Minimum Component Size	01005	High-density components should be located on sufficiently supported areas
Fine-Pitch Packages	BGA, QFN, QFP, LGA, CSP	Fine-pitch package areas require sufficient mechanical support during assembly
Minimum BGA Pitch	[Factory Confirm]	Final capability depends on pad design, component geometry and local board structure
Carrier / Fixture Support	Supported	Custom support helps protect flexible sections during printing and placement
Flex Zone Protection	Supported	Flexible transition and bend areas are considered during fixture and handling design
Stiffener Support	Supported	Stiffener location is reviewed against component placement and assembly process
Solder Paste Printing	Supported	Printing support is selected according to rigid and flex area geometry
SPI	3D SPI	Helps control solder paste before components enter placement
Reflow Soldering	Supported	Thermal profile is reviewed against mixed rigid-flex construction
Through-Hole Assembly	Supported	Available for applicable connectors and mechanically secured components
AOI	Supported	Checks visible assembly defects after placement and soldering
X-Ray Inspection	Supported	Used for BGA, QFN and other hidden solder joints
Electrical / Functional Testing	Supported	Test requirements can be integrated into the assembly process
Rework	Supported for Applicable Assemblies	Rework feasibility depends on component location and rigid-flex construction
Production Stages	Prototype, NPI, Low Volume, Volume Production	Supports rigid-flex assemblies through product validation and repeat manufacturing

HDI & Fine-Pitch PCB Assembly Capabilities

Assembly Item	LZJPCB Capabilities	Engineering Notes
Assembly Type	High-Density / Fine-Pitch Assembly	Suitable for compact layouts and high component density
Minimum Component Size	01005	Supports miniature passive components for dense PCB layouts
Fine-Pitch Packages	BGA, QFN, DFN, QFP, LGA, CSP	Package geometry and land pattern should be reviewed before production
Minimum BGA Pitch	[Factory Confirm]	Fine-pitch BGA designs require engineering verification
Placement Accuracy	[Factory Confirm]	Required accuracy varies according to package pitch and PCB pad design
Double-Sided SMT	Supported	Supports applicable high-density components on both PCB sides
Fine-Pitch Stencil Control	Supported	Stencil design and solder paste volume are evaluated for dense pad layouts
3D SPI	Supported	Detects solder paste variation before component placement
Automated SMT Placement	Supported	Suitable for miniature passive components and fine-pitch IC packages
Controlled Reflow	Supported	Thermal profile is adjusted according to board construction and component requirements
AOI	Supported	Checks visible components and solder joints after placement and reflow
X-Ray Inspection	Supported	Used to inspect BGA, QFN, LGA and other bottom-terminated components
BGA Rework	Supported	Controlled removal and replacement available for applicable packages
Electrical / Functional Testing	Supported	Testing can be defined according to product and customer requirements
Production Stages	Prototype, NPI, Low Volume, Volume Production	Allows the same project to move from validation into repeat manufacturing

Metal Core PCB Assembly Capabilities

Assembly Item	LZJPCB Capabilities	Engineering Notes
PCB Types	Aluminum PCB, Copper Core PCB	Suitable for LED, power electronics and thermal-management applications
Assembly Technologies	SMT, THT, Mixed Technology	Process route is selected according to component type and PCB construction
Assembly Sides	Single / Double-Sided Where Applicable	Actual assembly structure depends on the metal-core PCB design
Minimum Component Size	01005	Component capability should be checked against PCB design and assembly requirements
Fine-Pitch Packages	BGA, QFN, QFP and Applicable IC Packages	Package suitability depends on pad design and thermal behavior
PCB Thickness	[Factory Confirm]	Metal-core thickness affects thermal mass during soldering
Maximum PCB Size	[Factory Confirm]	Large boards may require specific handling and fixture review
High Thermal Mass Handling	Supported	Reflow settings are adjusted for the thermal behavior of metal-core substrates
Solder Paste Printing	Supported	Paste volume is selected according to component pads and thermal requirements
SPI	3D SPI	Helps verify solder paste before component placement
SMT Placement	Supported	Suitable for LEDs, power devices, controllers and applicable SMD components
Reflow Soldering	Supported	Thermal profiling is particularly important for high-conductivity substrates
Through-Hole Assembly	Supported Where Applicable	Available for connectors and power components depending on PCB construction
AOI	Supported	Checks visible placement and soldering defects
X-Ray Inspection	Supported Where Required	Available for packages with hidden solder joints
Electrical / Functional Testing	Supported	Testing can be configured according to application requirements
Conformal Coating	Supported	Available where environmental protection is required
Production Stages	Prototype, Low Volume, Volume Production	Supports thermal PCB assemblies from validation through repeat production

Ceramic PCB Assembly Capabilities

Assembly Item	LZJPCB Capabilities	Engineering Notes
PCB Type	Ceramic PCB (Al₂O₃, AlN, BeO)	Suitable for high-power, high-frequency, and high-temperature applications requiring superior thermal dissipation
Assembly Technologies	SMT, Die Bonding, Wire Bonding	Process route is selected based on component type, substrate construction and application requirements
Assembly Sides	Single-Sided, Double-Sided Where Applicable	Ceramic substrate construction and component placement should be reviewed before assembly planning
Minimum Component Size	0201 and Applicable Packages	Ceramic substrate fragility requires careful tooling and handling evaluation for fine components
Fine-Pitch Packages	QFN, LGA, Chip-on-Board, Applicable ICs	Package compatibility should be reviewed against ceramic substrate pad design and thermal characteristics
Substrate Handling	Engineering Controlled	Ceramic substrates are brittle; dedicated handling procedures and fixtures are required throughout assembly
Fixture / Carrier Support	Supported	Custom carriers protect ceramic substrates during printing, placement and reflow
Solder Paste Printing	Supported	Stencil design and paste selection are reviewed for ceramic substrate surface finish compatibility
SPI	3D SPI	Verifies paste deposition before component placement on ceramic substrates
Reflow Soldering	Supported -- Profiled for Ceramic	Thermal profile is carefully controlled to manage the high thermal conductivity and CTE mismatch of ceramic substrates
AOI	Supported	Checks component placement and visible solder joint quality after reflow
X-Ray Inspection	Supported Where Required	Used for bottom-terminated packages and hidden solder connections
Electrical / Functional Testing	Supported	Test method is defined according to application requirements and customer specifications
Production Stages	Prototype, Low Volume, Volume Production	Engineering assessment is recommended before committing ceramic PCB assemblies to production

Advanced and non-standard assembly specifications are subject to engineering confirmation based on PCB construction, component packages, BOM and assembly files.

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