MCPCB (Metal Core PCB) Manufacturer
LZJPCB manufactures custom metal core printed circuit boards with aluminum and copper core options, build-specific thermal dielectrics, controlled copper and board thickness, prototype support and production quality records. Send your Gerber, thermal target and mechanical data to receive a fixed manufacturing scope and quotation.
- Since 2006
- 50+ Engineers
- Thermal DFM
- 100% E-Test
MCPCB Manufacturing Capabilities
Use the published PCB baseline to screen LZJPCB, then qualify the selected metal core, thermal dielectric and finished construction through the project quotation.
| Qualification item | Manufacturing scope | Release evidence |
|---|---|---|
| Metal core | Aluminum and copper core options | Core grade, thickness and temper are named in the approved build. |
| Thermal dielectric | Project-selected thermal substrate | Material datasheet, dielectric thickness and thermal value are tied to the order. |
| Metal core thickness | 待补充 | Publish the qualified aluminum and copper core thickness ranges after supplier evidence is approved. |
| Dielectric thickness & conductivity | 待补充 | Publish only material-code-specific ranges supported by the matching supplier datasheet. |
| Copper weight | Up to 12 oz published PCB capability | Finished copper is fixed in the stackup and fabrication drawing. |
| Board thickness | 0.20–17.5 mm published PCB range | Metal core, dielectric and copper contributions are recorded separately. |
| Trace / space | 3 / 3 mil safe minimum | Current density, copper weight and etch compensation remain part of DFM. |
| Mechanical drill | 0.10 mm minimum | Hole insulation, plated/non-plated definition and metal clearance are reviewed. |
| Electrical isolation | 待补充 | State the verified test method and voltage range for each approved dielectric system. |
| MCPCB dimensional tolerances | 待补充 | Publish metal-core-specific thickness, flatness, outline and hole tolerances after validation. |
| Surface finish | Build-specific finish per drawing | Finish type, selective requirements and thickness are stated in the offer. |
| Inspection | AOI, X-ray and 100% electrical test | Material, dimensional, insulation and final test records follow the control plan. |
MCPCB Types We Manufacture
Select the structure from the heat path, circuit density, mechanical package and electrical isolation requirement—not from the material name alone.
Aluminum Core PCB
Aluminum core MCPCB combines a copper circuit, thermally conductive dielectric and aluminum base. It suits lighting, power conversion and control products that need efficient heat spreading with controlled electrical isolation.
Explore aluminum PCB →Copper Core PCB
Copper core PCB uses a copper metal base for stronger heat spreading and thermal mass. It is a metal-core construction and is not the same product as a conventional FR-4 heavy-copper board.
Explore copper PCB →Double-Sided Metal Core PCB
A double-sided metal core board places circuitry on both sides of the metal-backed structure. The approved drawing defines layer connection, insulated holes and clearances through the metal section.
Multilayer Metal Core PCB
A multilayer metal core PCB combines additional circuit layers with an integrated metal heat spreader. Production release follows the approved lamination, dielectric, interconnect and metal-core stackup.
Compare multilayer PCB →DTP MCPCB
Direct Thermal Path MCPCB creates a shortened conductive route from the component thermal pad to the metal base. The quotation states the exact DTP geometry, isolation boundaries and manufacturable structure.
MCPCB Materials & Thermal Performance
Material name, thermal conductivity, thermal resistance and thickness describe different parts of the heat path. A valid purchase specification keeps each one explicit.
Metal Core & Dielectric Materials
The metal core spreads heat. The thermally conductive dielectric transfers heat while maintaining electrical isolation. Copper carries current and forms the solderable circuit pattern.
- Aluminum or copper core grade and thickness are fixed in the approved build.
- Dielectric material, dielectric thickness and datasheet thermal conductivity are named together.
- Copper weight is selected for current, heat spreading and etch geometry.
- Thermal interface pads used in the finished assembly remain separate from the PCB dielectric specification.
MCPCB Thermal Conductivity & Thermal Resistance
Thermal conductivity is a material property. Thermal resistance describes how strongly the complete heat path resists heat flow. A high conductivity value does not by itself define board-level thermal performance.
- Quote requests state the target material value and the matching dielectric thickness.
- Thermal simulation uses the actual component footprint, copper area and mechanical interface.
- Qualification compares the approved stackup and test method, not isolated marketing numbers.
MCPCB Thickness & Construction
Finished MCPCB thickness is the sum of the metal core, thermal dielectric, copper and finished coating. The quotation lists these elements separately so purchasing can compare equivalent constructions.
- Total board thickness and tolerance are stated on the fabrication drawing.
- Metal core thickness is defined independently from the finished board thickness.
- Dielectric thickness remains visible because it directly influences isolation and heat transfer.
- Finished copper and solder mask requirements stay linked to current and assembly conditions.
MCPCB Design & DFM Guidelines
LZJPCB provides manufacturing DFM support. Your circuit and mechanical design remain the design authority; our review converts them into a controlled, buildable metal core construction.
Eight checks before quotation release
These checks link thermal intent, electrical isolation and metal-core manufacturing in one review.
Place heat-generating components over a continuous thermal spreading area.
Size copper for current, heat spreading, etch compensation and solder balance.
Pair dielectric thickness and conductivity with isolation voltage and thermal target.
Define plated, non-plated and insulated holes with metal clearances.
Keep copper, components and energized features clear of routed metal edges.
Balance copper and construction to control bow, twist and assembly contact.
Match finish and solder mask to pad geometry and assembly process.
Dimension screw holes, cutouts, TIM area and heat-sink contact surfaces.
MCPCB Applications
MCPCB creates value where the circuit must move heat into a chassis, heat sink or airflow path while preserving electrical isolation and production repeatability.
LED MCPCB & Metal Core PCB for Lighting
LED bulb boards, DOB boards, star MCPCB, linear strips, spotlight plates and 12 V LED modules use the metal core to spread heat away from LEDs and driver components. Wattage labels such as 3 W, 5 W, 9 W, 10 W or 25 W do not define one standard outline; the mechanical drawing fixes dimensions and mounting features.
Metal Core PCB for Automotive Electronics
Automotive lighting, power conversion, motor control and sensor modules use metal core boards to connect thermal loads to the vehicle’s mechanical heat path. Supplier qualification can be supported by LZJPCB’s IATF 16949 quality system.
Metal Core PCB for Industrial Automation
Motor drives, power supplies, relays, converters and machine-vision lighting use MCPCB to spread heat from power devices into the product chassis. The released construction links current density, isolation, metal core and mounting interface.
MCPCB Prototype & Custom Fabrication
Prototype the exact material, copper, thickness, outline and heat-sink interface that the production design will use. The quotation fixes the scope and lead-time before fabrication begins.
Four-step custom prototype route
This route supports custom MCPCB, metal core PCB prototypes and 2-layer aluminum MCPCB prototype briefs without publishing an unverified generic delivery claim.
Gerber, drill, outline, stackup, metal core, thermal target, copper, finish and quantity received.
Dielectric, heat path, hole insulation, clearances, flatness and panel route reviewed.
Quotation names the accepted construction, tooling, test plan, quantity and lead-time.
Prototype fabrication, AOI, dimensions, electrical test and requested thermal evidence completed.
MCPCB Quality Control & Thermal Reliability
The control plan verifies the factors that drive MCPCB performance: material identity, dielectric consistency, copper, metal thickness, electrical isolation, dimensions, flatness and finished heat path.
Metal core, dielectric, copper and lot records match the released bill of materials.
Imaging, etch and thickness checks protect current capacity and isolation geometry.
Metal clearances, insulation, routed edges and mounting features follow the approved drawing.
Finished thickness, outline, bow, twist and heat-sink contact features receive final measurement.
Every board receives electrical testing; specified insulation tests follow the order control plan.
Requested material certificates and defined thermal test records ship with the approved order scope.
Why Choose Us for Controlled MCPCB Thermal Release
One evidence chain keeps the selected metal base, dielectric, thermal path and released production record connected from engineering review to final shipment.
Thermal Path Control from Material Lock to Release Evidence
The differentiator is not a list of generic factory claims. It is the continuity between the material definition, manufacturable heat path and evidence issued for the same released construction.
Metal grade, core thickness, dielectric code, dielectric thickness, conductivity reference and copper are named together.
Pad geometry, copper spreading, isolation, mounting interface and DFM clarifications become one approved build definition.
Material records, dimensions, electrical isolation and requested thermal evidence follow the same order and lot.
MCPCB Case Studies
A valid MCPCB case study states the core, dielectric, conductivity, copper, thickness, heat load, temperature target, test method and measured result. These modules await customer-approved project records.
Use this record for an approved LED board project with a documented metal core, dielectric system and heat-sink interface.
Publish only after the customer authorizes the project data.
Use this record for an approved power board that moves heat from MOSFETs, diodes or regulators into the chassis.
Publish only after the customer authorizes the project data.
Use this record for an approved automotive project with traceable material, mechanical fit and thermal-cycle evidence.
Publish only after the customer authorizes the project data.
MCPCB Manufacturing Process
The process route follows the selected metal core structure. It controls the thermal dielectric, copper circuit, metal clearances, mechanical finish and electrical isolation instead of copying a generic FR-4 flow.
Metal core, thermal dielectric and copper are verified against the released material set.
The approved copper, dielectric and metal construction is prepared or laminated under its defined route.
Photo imaging and etch compensation create the copper circuit and thermal spreading geometry.
Plated, non-plated or insulated holes follow metal-clearance and electrical isolation controls.
Solder mask, legends and the specified finish prepare pads for assembly and protect the circuit.
Outline, mounting features, thickness, flatness, insulation and electrical continuity are released.
Get an MCPCB Quote
Send one complete data package. The returned quotation states the accepted metal-core construction, test scope, quantity price and fixed lead-time.
Inputs that set MCPCB cost
MCPCB and LED board price is calculated from the released construction. These eight inputs remove open commercial assumptions.
- Gerber / ODB++ and NC drill data
- Aluminum or copper core material and thickness
- Thermal dielectric material, thickness and conductivity target
- Finished copper weight and total board thickness
- Outline, dimensions, holes, cutouts and flatness requirements
- Surface finish, solder mask and marking
- Prototype quantity and annual production quantity
- Electrical, isolation and thermal test requirements
Accepted construction, tooling, inspection, test plan, quantity price breaks and fixed quoted lead-time.
Frequently Asked Questions About MCPCB
Short definitions for product selection without turning the product page into a general PCB glossary.
What Does MCPCB Stand For?
MCPCB stands for Metal Core Printed Circuit Board. The term also appears as metal core PCB, metal-backed PCB or metal-based PCB. It describes a circuit board that uses a metal base to spread heat away from electronic components.
What Is an MCPCB?
An MCPCB is a printed circuit board built with a copper circuit layer, thermally conductive electrical-insulation layer and metal core. The dielectric transfers heat from the circuit into the metal base while isolating the copper electrically. Aluminum and copper are the primary core options on this page.
What Is an MCPCB for LED?
An LED MCPCB is a metal core board designed to carry LED circuits and move heat into a luminaire body or heat sink. DOB, star, strip, bulb and spotlight boards are application shapes; the electrical design, outline, voltage, wattage and mounting dimensions come from the product specification. See the LED application section.
What Is the Difference Between a PCB Core and a Metal Core PCB?
In a conventional multilayer PCB, a “core” is a copper-clad dielectric laminate used inside the stackup. In a metal core PCB, the core is a metal base used for heat spreading. The two terms describe different materials and functions, so a generic “core PCB” request must state whether it means a laminate core or an MCPCB metal base.
Send the Gerber, metal core, dielectric target, copper, thickness, outline, quantity and test requirements. Receive one documented manufacturing scope with a fixed quoted lead-time.